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Engineered for high dielectric strength, low partial discharge, and rapid heat dissipation in demanding North American mission-critical applications.
The industrial landscape across the United States is witnessing a rapid technological transformation driven by the electrification of transportation, reshoring of advanced semiconductor packaging, modernization of power grids, and aerospace exploration. Within these cutting-edge sectors, non-conductive epoxy resins play an indispensable role as foundational dielectric materials.
Unlike standard adhesive polymers, modern electrically insulating (non-conductive) epoxies must deliver high volume resistivity (>1014 Ω·cm), superior breakdown voltage ratings (>20 kV/mm), and low dielectric constants while simultaneously facilitating aggressive thermal transfer. As American OEMs scale up power densities in electric vehicle (EV) battery modules, 800V fast-charging infrastructure, and high-frequency avionics, the risk of partial discharge, arcing, and thermal runaway escalates. Non-conductive epoxies engineered with specialized ceramic and mineral fillers (such as alumina, aluminum nitride, and boron nitride) eliminate conductive pathways, providing total electrical isolation without compromising heat dissipation.
Customized formulation architectures delivering dependable isolation, environmental sealing, and structural integrity across key American industry verticals.
With North American gigafactories accelerating production in Michigan, Ohio, and Texas, our high-voltage non-conductive potting compounds encapsulate busbars, battery management system (BMS) boards, and IGBT modules, preventing high-voltage breakdown and partial discharge while structurally bonding prismatic and cylindrical cells.
Engineered to comply with stringent US military specifications (MIL-STD) and NASA ASTM E595 outgassing standards, these epoxies provide void-free potting for airborne phased-array radar, navigation avionics, and orbital satellite power modules exposed to cryogenic temperatures and extreme thermal shocks.
Serving Silicon Valley, Arizona, and Oregon chip fabrication centers, our non-conductive underfills and glob-top encapsulants protect fragile wire bonds, surface-mount components, and flip-chip dies against moisture ingress, thermal fatigue, and mechanical shock during high-yield automated SMT assembly.
For US solar inverter manufacturers and wind turbine control systems, our two-component dielectric resins provide durable weatherproofing, UV resistance, and thermal stress relief for transformers, switchgears, and current sensors operating continuously in harsh outdoor climates.
Formulated with non-cytotoxic, biocompatible polymer backbones complying with ISO 10993 and USP Class VI, our insulating epoxies seal MRI gradient coils, surgical ultrasound transducers, and implantable sensor housings against sterilization chemicals and autoclave cycles.
Providing minimal dielectric loss (low Dk/Df) and stable dielectric constants up to millimeter-wave frequencies, ensuring signal integrity in base station power amplifiers, RF front-end modules, and optical transceivers across North American communication networks.
Comprehensive property comparison for non-conductive, thermally conductive, and dielectric protection epoxies.
| Formulation Series | Dielectric Strength | Volume Resistivity | Thermal Conductivity | Operating Range | Flame Rating & Compliance |
|---|---|---|---|---|---|
| SX-EP810 High-Voltage Potting | > 25 kV/mm | 1.8 × 1015 Ω·cm | 1.2 - 2.5 W/m·K | -50°C to +180°C | UL 94 V-0 / RoHS / REACH |
| SX-AD520 PCBA Dielectric Bond | > 22 kV/mm | 4.5 × 1014 Ω·cm | 2.0 - 3.5 W/m·K | -45°C to +160°C | UL 94 V-0 / Halogen Free |
| SX-UF300 Micro Underfill | > 28 kV/mm | 8.0 × 1015 Ω·cm | 0.8 - 1.5 W/m·K | -55°C to +175°C | IPC-CC-830 / NASA Low Outgas |
| SX-EMI60 Silver Shielding Sealant | N/A (< 0.01 Ω·cm) | Electrically Conductive | 1.8 W/m·K | -55°C to +150°C | MIL-STD-810G / >60dB Shielding |
| SX-GL900 Optoelectronic Clear | > 24 kV/mm | 2.2 × 1015 Ω·cm | 0.4 - 0.8 W/m·K | -40°C to +150°C | UL 94 HB / UV Stable Non-Yellowing |
Comprehensive adhesive, potting, and thermal management capabilities customized for international OEMs.
Songxi's business covers three functional areas: adhesive & sealing, potting & protection, and thermal interface materials. Our product portfolio includes PCBA fixing adhesives, UV adhesives, sealants, thermal conductive potting compounds, thermal greases, pads, two-component thermal gels, EMI shielding sealants, and reactive hot melt adhesives.
Our products serve power batteries, photovoltaic modules, drones, automotive electronics, 5G communications, and LED lighting. We provide both standard products and customized solutions for applications such as BMS conformal coating, IGBT thermal filling, and power battery structural bonding, supported by extensive technical experience and application expertise.
Led by a Ph.D. in Polymer Materials from Sichuan University, Songxi's R&D team has nearly twenty years of silicone and epoxy application experience and has participated in over 100 product development projects. We maintain cooperation with research institutions including Chenguang Chemical Research Institute, Sichuan University, and Beijing Institute of Technology.
Certified with ISO9001, Songxi operates a comprehensive management system covering procurement, production, inspection, and after-sales service. Our products comply with RoHS and REACH requirements, with SGS verification and UL 94 V-0 flame retardant certification, ensuring consistent quality and reliable delivery for US partners.
Explore our complete spectrum of UL-certified, high-reliability epoxy and silicone solutions.
Songxi adheres to integrity and quality throughout material selection, production, and delivery, turning reliability into a competitive advantage and earning long-term customer trust through professional service and continuous improvement across global markets.
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