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Engineered to exceed strict US manufacturing benchmarks, our high-strength super glue epoxy formulations deliver rapid fixturing, structural resilience, and superior thermal dissipation.
High-efficiency heat conduction epoxy engineered for PCBA assemblies, power supplies, and semiconductor packages requiring rapid heat path transfer.
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Precision silver-filled conductive sealant offering over 60dB electromagnetic shielding effectiveness across critical gigahertz radar frequencies.
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Combines 90-second instant fixturing speed with epoxy shear strength (>25 MPa), built specifically for automated US robotic dispensing lines.
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Low-viscosity, deep-penetrating dielectric potting compound certified to UL 94 V-0 standards for extreme temperature and vibration immunity.
View Product Details →Why advanced American manufacturing hubs are transitioning from conventional adhesives to hybrid cyanoacrylate-epoxy structural chemistry.
The industrial adhesives sector across the United States is witnessing a generational evolution. With the reshoring of advanced semiconductor fabrication under the CHIPS Act, explosive growth across the Sun Belt’s electric vehicle (EV) gigafactories, and strict avionics specifications along the Pacific Northwest, traditional cyanoacrylates and basic 2-part epoxies can no longer satisfy contemporary production criteria independently.
Modern US manufacturing requires both the instant cycle-time reduction of super glues (cyanoacrylates) and the permanent environmental resistance, mechanical toughness, and thermal conductivity of cross-linked structural epoxies. Hybrid Super Glue Epoxy chemistries provide a definitive answer—delivering handling strength in under 3 minutes while curing into an ultra-tough matrix resistant to thermal cycling from -55°C to 180°C.
Songxi Technology fulfills this demanding market demand by supplying custom-engineered, export-grade polymer systems compliant with NASA outgassing, ASTM structural shear guidelines, and UL flammability standards.
| Engineering Property | Standard Super Glue | Songxi Super Glue Epoxy Hybrid |
|---|---|---|
| Fixturing Speed | 10 – 30 seconds | 60 – 180 seconds |
| Lap Shear Strength (Al-Al) | 8 – 12 MPa (Brittle) | 24 – 32 MPa (High Impact) |
| Gap Filling Capability | < 0.05 mm | Up to 5.0 mm |
| Thermal Conductivity | ~0.15 W/m·K | 1.5 – 3.8 W/m·K |
| Thermal Resistance Range | -30°C to +80°C | -55°C to +180°C |
| Moisture & Chemical Aging | Prone to debonding | MIL-STD-883 Compliant |
PCBA heat dissipation, BGA underfill reinforcement, and flip-chip encapsulation where high dielectric strength and thermal conductance are paramount.
Structural battery cell-to-pack bonding, BMS moisture sealing, and high-voltage IGBT potting with UL 94 V-0 flame-retardant certification.
Silver-filled EMI shielding sealants engineered for airborne radar, telemetry radomes, and satellite avionics requiring >60dB attenuation.
Dual-cure micro-bonding adhesives for endoscopic sensors, fiber optic alignments, and portable diagnostic housings.
Songxi Technology is a high-tech enterprise specializing in the R&D, production, and sales of electronic adhesives. Based on silicone, polyurethane, acrylic, and epoxy systems, we provide reliable bonding, sealing, and protection solutions for power electronics, optoelectronics, new energy, automotive, and aerospace industries.
We are committed to becoming a trusted provider of functional polymer material solutions for the electronics industry. Through continuous innovation and application development, we promote the localization of high-end electronic adhesives and help intelligent devices achieve greater stability and durability.
Bridging technical polymer synthesis with specialized field engineering for global supply chains.
Songxi's business covers three functional areas: adhesive & sealing, potting & protection, and thermal interface materials. Our product portfolio includes PCBA fixing adhesives, UV adhesives, sealants, thermal conductive potting compounds, thermal greases, pads, two-component thermal gels, EMI shielding sealants, and reactive hot melt adhesives.
Our products serve power batteries, photovoltaic modules, drones, automotive electronics, 5G communications, and LED lighting. We provide both standard products and customized solutions for applications such as BMS conformal coating, IGBT thermal filling, and power battery structural bonding, supported by extensive technical experience and application expertise.
Led by a Ph.D. in Polymer Materials from Sichuan University, Songxi's R&D team has nearly twenty years of silicone application experience and has participated in over 100 product development projects. We maintain cooperation with research institutions including Chenguang Chemical Research Institute, Sichuan University, and Beijing Institute of Technology.
Certified with ISO9001, Songxi operates a comprehensive management system covering procurement, production, inspection, and after-sales service. Our products comply with RoHS and REACH requirements, with SGS verification and UL 94 V-0 flame retardant certification, ensuring consistent quality and reliable delivery across all international export batches.
Ensuring batch traceability, compliance with United States hazardous material transport codes, and temperature-controlled freight logistics.
Exporting chemical formulation compounds to American ports—such as Long Beach, Los Angeles, Savannah, and Newark—demands full regulatory clarity. Songxi provides end-to-end documentation packs including:
For US design engineers in prototyping stages, we offer expedited 5-day sample dispatch to any US state, accompanied by full viscosity, lap shear, and glass transition temperature (Tg) test curves.
Browse our complete range of certified epoxy and cyanoacrylate solutions customized for US automotive, aerospace, telecom, and optoelectronic manufacturing.
Fast-setting structural formulation delivering 2.5 W/m·K thermal conductance for dense power electronics and surface-mount components.
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High-purity silver flake dispersion engineered for airborne radar, waveguide sealing, and RF microwave component packaging.
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Toughened elastomer-modified hybrid providing 2-minute fixturing and high peel resistance on metal, ceramic, and composite substrates.
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Low-stress, highly conformable dielectric potting compound designed for EV onboard chargers and high-power inverter modules.
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Sub-micron shrinkage adhesive with secondary thermal cure mechanism for shadowed optical sub-assemblies and lidar sensors.
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Resistant to automotive fuels, lubricants, and continuous thermal cycling between -40°C and 160°C for under-the-hood micro-sensors.
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Engineered with optimized coefficient of thermal expansion (CTE) to eliminate solder joint fatigue in high-reliability US defense computing.
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Ultra-thin bondline capability with high initial green strength designed for robotic assembly of smart glasses, wearables, and smartphones.
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