Advanced silicone and functional polymer systems engineered for PCBA barrier protection and structural reliability.
Comprehensive market dynamics, miniaturization demands, and the shift from transparent varnishes to functional black silicone matrices.
Prevents copper and silver electrochemical migration across micro-pitch SMD pads, suppressing parasitic leakage currents under continuous high-humidity, direct-current bias test conditions.
Opaque deep black coloration completely conceals integrated circuit markings, traces, and proprietary wire-bonding architectures, providing anti-tamper security while blocking stray photons in optical subassemblies.
Exhibits low surface energy, creating a high water contact angle (>105°) that eliminates liquid bridging and provides hermetic defense against atmospheric humidity, surfactant solutions, and synthetic human sweat.
The scientific foundation behind high-reliability silicone elastomer coatings and room-temperature vulcanization mechanics.
| Performance Characteristic | Black Silicone Sealant / Coating | Polyurethane (PU) Conformal | Acrylic (AR) Conformal | Epoxy (ER) Potting System |
|---|---|---|---|---|
| Thermal Operating Window | -55°C to +200°C (Superior) | -40°C to +125°C | -40°C to +130°C | -50°C to +150°C |
| Stress Relief / Elasticity (Elongation) | 150% – 350% (High Cushioning) | 50% – 120% | 10% – 30% (Brittle) | < 10% (Rigid / High Stress) |
| Dielectric Strength (kV/mm) | > 20 - 25 kV/mm | 15 - 18 kV/mm | 15 - 20 kV/mm | 18 - 22 kV/mm |
| Reworkability / Serviceability | Easy (Peelable / Selective Cut) | Difficult (Requires Solvents) | Very Easy (Chemical Stripping) | Extremely Difficult / Irreversible |
| Moisture & Salt Spray Resistance | Outstanding (Hydrophobic) | High | Moderate | Outstanding |
Tailored encapsulation strategies for demanding form factors and critical operational environments.
Provides dam-and-fill protection around fine-pitch flexible printed circuits (FPC), camera image sensor modules, and fast-charging power management ICs against drop shocks, micro-vibrations, and condensation ingress.
Forms an impenetrable barrier over micro-switches, charging contacts, and lithium battery protection boards (PCM), resisting synthetic perspiration, skin oils, and rapid temperature changes during outdoor athletic use.
Acts as an ultra-flexible conformal buffer for electronic speed controllers (ESC) and GPS modules, attenuating high-frequency motor resonance and protecting exposed copper traces in coastal salt-fog environments.
Comprehensive adhesive portfolios and tailored material engineering for global high-tech manufacturers.
Songxi's business covers three functional areas: adhesive & sealing, potting & protection, and thermal interface materials. Our product portfolio includes PCBA fixing adhesives, UV adhesives, sealants, thermal conductive potting compounds, thermal greases, pads, two-component thermal gels, EMI shielding sealants, and reactive hot melt adhesives.
Our products serve power batteries, photovoltaic modules, drones, automotive electronics, 5G communications, and LED lighting. We provide both standard products and customized solutions for applications such as BMS conformal coating, IGBT thermal filling, and power battery structural bonding, supported by extensive technical experience and application expertise.
Rigorous chemical analysis, modern synthesis facilities, and global compliance verification.


















Browse our complete catalog of structural bonding, PCBA conformal coating, and thermal management compounds.
Songxi adheres to integrity and quality throughout material selection, production, and delivery, turning reliability into a competitive advantage and earning long-term customer trust through professional service and continuous improvement across global markets.