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Engineered to comply with stringent IPC-CC-830, UL 94 V-0 flame retardancy, and RoHS/REACH environmental standards for North American electronics manufacturing.
The electronics manufacturing sector across the United States is witnessing a massive resurgence. Driven by federal initiatives such as the CHIPS and Science Act, along with unprecedented investments in electric vehicle (EV) infrastructure, renewable energy microgrids, and defense automation, North American PCB contract manufacturers (CMs) and Original Equipment Manufacturers (OEMs) demand high-performance encapsulants and bonding compounds.
Non-conductive epoxy for PCB assemblies plays an indispensable role across vital American manufacturing clusters:
Eliminates parasitic capacitance, prevents short circuits, and withstands dielectric breakdown voltages exceeding 25 kV/mm across high-density circuit routing.
Tailored rheological properties and thixotropic indexing ensure seamless integration with US automated pneumatic, jetting, and auger dispensing lines (Asymtek, Nordson).
Songxi Technology is a high-tech enterprise specializing in the R&D, production, and sales of electronic adhesives. Based on silicone, polyurethane, acrylic, and epoxy systems, we provide reliable bonding, sealing, and protection solutions for power electronics, optoelectronics, new energy, automotive, and aerospace industries.
We are committed to becoming a trusted provider of functional polymer material solutions for the electronics industry. Through continuous innovation and application development, we promote the localization of high-end electronic adhesives and help intelligent devices achieve greater stability and durability.
Comprehensive polymer formulations engineered to solve complex electronic isolation, thermal dissipation, and structural bonding challenges.
Songxi's business covers three functional areas: adhesive & sealing, potting & protection, and thermal interface materials. Our product portfolio includes PCBA fixing adhesives, UV adhesives, sealants, thermal conductive potting compounds, thermal greases, pads, two-component thermal gels, EMI shielding sealants, and reactive hot melt adhesives.
Our products serve power batteries, photovoltaic modules, drones, automotive electronics, 5G communications, and LED lighting. We provide both standard products and customized solutions for applications such as BMS conformal coating, IGBT thermal filling, and power battery structural bonding, supported by extensive technical experience and application expertise.
Meeting the evolving design constraints of higher voltage ratings, extreme thermal cycling, and micron-level component pitch.
Modern US designs using high-layer-count HDI boards require epoxies with matched coefficients of thermal expansion (CTE < 25 ppm/°C below Tg) to prevent solder joint fatigue and pad cratering during -55°C to 150°C thermal cycling.
Integrating rapid UV snap-cure (5-10 seconds) for instant surface component immobilization followed by secondary thermal shadow curing ensures 100% cure under opaque BGA and SMD packages without thermal degradation.
Complete compliance with US environmental regulations, EPA TSCA requirements, IEC 61249-2-21 halogen-free criteria, and strict RoHS/REACH SVHC lists, ensuring hassle-free importation and regulatory peace of mind.
| Property Parameter | Standard Non-Conductive Epoxy | Songxi US-Grade High Reliability Grade | Test Method / Compliance |
|---|---|---|---|
| Volume Resistivity (Ω·cm) | 1.0 × 10¹⁴ | > 5.0 × 10¹⁵ | ASTM D257 |
| Dielectric Strength (kV/mm) | 18 - 20 | > 28.5 | ASTM D149 |
| Glass Transition Temp (Tg, °C) | 90 - 110 | 135 - 165 | DMA / DSC |
| Thermal Conductivity (W/m·K) | 0.2 - 0.3 | 1.2 - 3.5 | ASTM D5470 |
| Flame Retardancy Rating | HB / None | UL 94 V-0 Recognized | UL 94 |
| Ionic Content (Cl⁻, Na⁺, K⁺) | < 50 ppm | < 5 ppm (Semiconductor Grade) | Ion Chromatography |
Precision formulations customized to withstand the harshest environments across American industrial sectors.
Electrolytic capacitors, heavy inductors, and tall transformers on industrial power boards are prone to solder joint cracking under mechanical shock and vibration. Our high-thixotropy non-conductive epoxy bonds components securely to the FR-4/polyimide substrate without slump or bridging adjacent copper traces.
In high-density US computing and telecommunications hardware, our ultra-low viscosity non-conductive epoxies utilize capillary flow to encapsulate micro-bumps beneath flip-chips and BGAs. This mitigates thermal stress differentials between silicon dies and PCB laminates, boosting drop-test survival by up to 500%.
High-voltage partial discharge poses a critical hazard in 800V EV architectures and 1500V solar array inverters. Our potting and encapsulating compounds eradicate micro-voids, providing impenetrable dielectric isolation, moisture barriers, and thermal dissipation in extreme climatic conditions across North America.
Led by a Ph.D. in Polymer Materials from Sichuan University, Songxi's R&D team has nearly twenty years of silicone application experience and has participated in over 100 product development projects. We maintain cooperation with research institutions including Chenguang Chemical Research Institute, Sichuan University, and Beijing Institute of Technology.
Certified with ISO9001, Songxi operates a comprehensive management system covering procurement, production, inspection, and after-sales service. Our products comply with RoHS and REACH requirements, with SGS verification and UL 94 V-0 flame retardant certification, ensuring consistent quality and reliable delivery.
Explore our complete catalog of certified non-conductive epoxies, potting materials, and EMI shielding solutions.
Songxi adheres to integrity and quality throughout material selection, production, and delivery, turning reliability into a competitive advantage and earning long-term customer trust through professional service and continuous improvement across global markets.
