China Suppliers Factory for Thermal Grease and Thermal Pads - High-Performance Thermal Interface Materials
Thermal Grease Series (1.5–6.0 W/m·K)
At chip level, bond line thickness is critical. Songxi's thermal compound grease uses sub-micron conductive fillers in a shear-stable silicone matrix, spreading into microscopic surface textures and compressing to ultra-thin bonds under assembly pressure. As a thermal transfer grease, it resists pump-out under thermal cycling, remaining stable even after years at 150°C.
Key Features
Specifications
| Thermal Conductive Pad Series | |||||||||
|---|---|---|---|---|---|---|---|---|---|
| Color | Gray White | Dark Gray | Blue | Pink | Reddish Brown | Gray | Gray | Gray | Gray |
| Thermal Conductivity (W/mK) | 1.5 | 2.0 | 3.0 | 4.0 | 5.0 | 6.0 | 7.0 | 8.0 | 10.0 |
| Thickness (mm) | 0.2-12 | 0.2-12 | 0.3-12 | 0.3-5.0 | 0.5-5.0 | 0.5-5.0 | 0.5-5.0 | 0.5-5.0 | 0.5-5.0 |
| Hardness (Shore 00) | 30-90 | 30-90 | 30-90 | 30-90 | 60-90 | 60-90 | 50-80 | 50-80 | 50-80 |
| Density (g/cc) | 2.1 | 2.3 | 2.9 | 3.2 | 3.0 | 3.3 | 3.4 | 3.4 | 3.4 |
Applications
Thermal Conductive Pad Series (1.5–10.0 W/m·K)
For full assemblies—BMS packs, inverters, multi-board enclosures—gaps are larger and less predictable. Songxi's thermal gap pads use a compliant low-hardness elastomer that deforms under low assembly force, filling uneven gaps without stressing components. As a thermal conductive silicone pad, it provides both thermal conduction and electrical isolation. Fiberglass reinforcement resists tearing, and low-volatile formulation limits oil bleeding.
Key Features
Specifications
| Thermal Conductive Grease Series | |||||||
|---|---|---|---|---|---|---|---|
| Color | White | White | White | White | White | White | White |
| Thermal Conductivity (W/mK) | 1.5 | 2.0 | 3.0 | 3.5 | 4.0 | 5.0 | 6.0 |
| Extrusion Rate (g/min) | 75±15 | 75±15 | 30±5 | 30±5 | 30±5 | 25±5 | 15±5 |
| Density (g/cc) | 2.3 | 2.5 | 3.0 | 3.0 | 3.1 | 3.2 | 3.3 |
Applications
Frequently Asked Questions
Songxi's Thermal Grease Series delivers thermal conductivities from 1.5 to 6.0 W/m·K, while the Thermal Conductive Pad Series provides an extensive performance range from 1.5 up to 10.0 W/m·K.
It features sub-micron conductive fillers suspended within a shear-stable silicone matrix. This specialized anti-pump-out formulation compresses into ultra-thin bonds under assembly pressure and maintains long-term structural stability even after years of operation at 150°C.
They utilize compliant, low-hardness elastomers that deform easily under low assembly forces, efficiently filling large and uneven gaps without placing mechanical stress on sensitive electronic components.
Thermal grease is engineered for chip-level thermal interfaces, including industrial IGBT modules, EV power electronics (OBC, power drives), smart home mainboards, and high-frequency microprocessor packaging.
Yes. Songxi thermal silicone pads are engineered to offer high dielectric isolation alongside efficient thermal transfer, with fiberglass reinforcement for enhanced tear resistance and low-volatile formulations to limit oil bleeding.
Thermal pads are widely used in automotive power modules (BMS, OBC), industrial control inverters, telecommunications hardware, and high-power smart home appliances.
