China Thermal Interface Materials Supplier: Silicone Thermal Grease & Pads from Factory for Optimal Heat Transfer
Thermal Grease Series (1.5–6.0 W/m·K)
At chip level, bond line thickness is critical. Songxi's thermal compound grease uses sub-micron conductive fillers in a shear-stable silicone matrix, spreading into microscopic surface textures and compressing to ultra-thin bonds under assembly pressure. As a thermal transfer grease, it resists pump-out under thermal cycling, remaining stable even after years at 150°C.
Key Features
Ultra-low thermal resistance with sub-micron fillers
Anti-pump-out matrix for thermal cycle stability
Excellent wetting for void-free contact
Non-curing, stable at high temperatures
Rheology tuned for automated dispensing
Specifications
| Thermal Conductive Pad Series | |||||||||
|---|---|---|---|---|---|---|---|---|---|
| Color | Gray White | Dark Gray | Blue | Pink | Reddish Brown | Gray | Gray | Gray | Gray |
| Thermal Conductivity (W/mK) | 1.5 | 2.0 | 3.0 | 4.0 | 5.0 | 6.0 | 7.0 | 8.0 | 10.0 |
| Thickness (mm) | 0.2-12 | 0.2-12 | 0.3-12 | 0.3-5.0 | 0.5-5.0 | 0.5-5.0 | 0.5-5.0 | 0.5-5.0 | 0.5-5.0 |
| Hardness (Shore 00) | 30-90 | 30-90 | 30-90 | 30-90 | 60-90 | 60-90 | 50-80 | 50-80 | 50-80 |
| Density (g/cc) | 2.1 | 2.3 | 2.9 | 3.2 | 3.0 | 3.3 | 3.4 | 3.4 | 3.4 |
Application Scope
Applications
Industrial IGBT modules, EV power electronics (OBC, power drives), smart home mainboards, and high-frequency microprocessor packaging.
Thermal Conductive Pad Series (1.5–10.0 W/m·K)
For full assemblies—BMS packs, inverters, multi-board enclosures—gaps are larger and less predictable. Songxi's thermal gap pads use a compliant low-hardness elastomer that deforms under low assembly force, filling uneven gaps without stressing components. As a thermal conductive silicone pad, it provides both thermal conduction and electrical isolation. Fiberglass reinforcement resists tearing, and low-volatile formulation limits oil bleeding.
Key Features
Broad conductivity range (1.5–10.0 W/m·K)
High compressibility for large gaps
Low oil bleeding, protects nearby components
High dielectric isolation
Tear-resistant for automated assembly
Specifications
| Thermal Conductive Grease Series | |||||||
|---|---|---|---|---|---|---|---|
| Color | White | White | White | White | White | White | White |
| Thermal Conductivity (W/mK) | 1.5 | 2.0 | 3.0 | 3.5 | 4.0 | 5.0 | 6.0 |
| Extrusion Rate (g/min) | 75±15 | 75±15 | 30±5 | 30±5 | 30±5 | 25±5 | 15±5 |
| Density (g/cc) | 2.3 | 2.5 | 3.0 | 3.0 | 3.1 | 3.2 | 3.3 |
Application Scope
Applications
Automotive power modules (BMS, OBC), industrial control inverters, telecom hardware, and high-power smart home appliances.
Frequently Asked Questions
Q
What makes Songxi's thermal grease ideal for chip-level heat dissipation?
It uses sub-micron conductive fillers in a shear-stable silicone matrix that flows into microscopic surface textures and compresses to an ultra-thin bond line under assembly pressure. It also resists pump-out during thermal cycling and maintains stability at 150°C.
Q
What thermal conductivity ranges are offered across the product lines?
The Thermal Grease Series provides conductivity ranges from 1.5 to 6.0 W/m·K, while the Thermal Conductive Pad Series covers a broad range from 1.5 to 10.0 W/m·K.
Q
When should I choose Thermal Conductive Pads over Thermal Grease?
Thermal conductive pads are best suited for full assemblies like BMS packs, inverters, and multi-board enclosures where gaps are larger and uneven. They compress under low force without component stress and offer both thermal transfer and electrical isolation.
Q
How do Songxi thermal gap pads prevent damage during high-volume assembly?
The pads feature fiberglass reinforcement that resists tearing during automated placement, combined with a low-volatile formulation that minimizes oil bleeding to protect surrounding electronic components.
Q
Are these thermal interface materials compatible with automated dispensing?
Yes. The thermal grease features rheology specifically tuned for automated dispensing, while the thermal pads are tear-resistant and designed for reliable pick-and-place automation.
Q
What are the key application sectors for these thermal interface materials?
Key applications include automotive power electronics (EV OBC, power drives, BMS), industrial IGBT modules, industrial control inverters, telecom hardware, smart home mainboards, and high-frequency microprocessor packaging.
