China Thermal Interface Materials Suppliers - Thermal Grease & Pads Factory for Optimal Heat Management
Thermal Grease Series (1.5–6.0 W/m·K)
At chip level, bond line thickness is critical. Songxi's thermal compound grease uses sub-micron conductive fillers in a shear-stable silicone matrix, spreading into microscopic surface textures and compressing to ultra-thin bonds under assembly pressure. As a thermal transfer grease, it resists pump-out under thermal cycling, remaining stable even after years at 150°C.
Ultra-low thermal resistance with sub-micron fillers
Anti-pump-out matrix for thermal cycle stability
Excellent wetting for void-free contact
Non-curing, stable at high temperatures
Rheology tuned for automated dispensing
| Thermal Conductive Pad Series | |||||||||
| Color | Gray White | Dark Gray | Blue | Pink | Reddish Brown | Gray | Gray | Gray | Gray |
| Thermal Conductivity (W/mK) | 1.5 | 2.0 | 3.0 | 4.0 | 5.0 | 6.0 | 7.0 | 8.0 | 10.0 |
| Thickness (mm) | 0.2-12 | 0.2-12 | 0.3-12 | 0.3-5.0 | 0.5-5.0 | 0.5-5.0 | 0.5-5.0 | 0.5-5.0 | 0.5-5.0 |
| Hardness (Shore 00) | 30-90 | 30-90 | 30-90 | 30-90 | 60-90 | 60-90 | 50-80 | 50-80 | 50-80 |
| Density (g/cc) | 2.1 | 2.3 | 2.9 | 3.2 | 3.0 | 3.3 | 3.4 | 3.4 | 3.4 |
Applications
industrial IGBT modules, EV power electronics (OBC, power drives), smart home mainboards, and high-frequency microprocessor packaging.
Thermal Conductive Pad Series (1.5–10.0 W/m·K)
For full assemblies—BMS packs, inverters, multi-board enclosures—gaps are larger and less predictable. Songxi's thermal gap pads use a compliant low-hardness elastomer that deforms under low assembly force, filling uneven gaps without stressing components. As a thermal conductive silicone pad, it provides both thermal conduction and electrical isolation. Fiberglass reinforcement resists tearing, and low-volatile formulation limits oil bleeding.
Broad conductivity range (1.5–10.0 W/m·K)
High compressibility for large gaps
Low oil bleeding, protects nearby components
High dielectric isolation
Tear-resistant for automated assembly
| Thermal Conductive Grease Series | |||||||
| Color | White | White | White | White | White | White | White |
| Thermal Conductivity (W/mK) | 1.5 | 2.0 | 3.0 | 3.5 | 4.0 | 5.0 | 6.0 |
| Extrusion Rate (g/min) | 75±15 | 75±15 | 30±5 | 30±5 | 30±5 | 25±5 | 15±5 |
| Density (g/cc) | 2.3 | 2.5 | 3.0 | 3.0 | 3.1 | 3.2 | 3.3 |
Applications
automotive power modules (BMS, OBC), industrial control inverters, telecom hardware, and high-power smart home appliances.
Frequently Asked Questions (FAQ)
Q1: What is the primary difference between thermal grease and thermal pads?
Thermal grease is optimized for chip-level, ultra-thin bond lines requiring ultra-low thermal resistance under assembly pressure. Thermal conductive pads are designed for full assemblies (like BMS packs and inverters) to bridge larger, uneven gaps while offering dielectric isolation.
Q2: How does Songxi thermal grease prevent pump-out issues?
It utilizes sub-micron conductive fillers within a shear-stable silicone matrix that maintains structural integrity under repeated thermal cycling, staying stable even after prolonged exposure at 150°C.
Q3: What thermal conductivity ranges are available for thermal pads?
The thermal conductive pad series offers a wide thermal conductivity range from 1.5 W/m·K up to 10.0 W/m·K with various thickness options (0.2mm to 12mm) to suit different cooling demands.
Q4: Are the thermal conductive silicone pads tear-resistant during installation?
Yes. Songxi thermal pads feature fiberglass reinforcement that resists tearing, making them highly durable and well-suited for automated assembly processes.
Q5: Can Songxi thermal grease be applied with automated dispensing systems?
Yes. The grease has its rheology specifically tuned for high-precision automated dispensing equipment, ensuring smooth extrusion and consistent void-free interface wetting.
Q6: Do thermal pads cause oil bleeding on sensitive electronic components?
Songxi thermal pads use low-volatile formulations engineered to strictly limit silicone oil bleeding, protecting surrounding circuitry and sensitive components from contamination.
