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China Thermal Interface Materials Suppliers: Thermal Grease & Pads Factory for Optimal Heat Management Solutions

Songxi Technology, a leading supplier and factory in China, offers a premium range of Interface Thermal Materials comprising two distinct series: the Thermal Grease Series (1.5–6.0 W/m·K) and the Thermal Conductive Pad Series (1.5–10.0 W/m·K). Our silicone-based thermal interface materials are engineered to effectively eliminate air gaps between heat-generating components and heatsinks. The Thermal Grease is ideal for achieving optimal contact at thin, chip-level points, while our Thermal Conductive Pads are designed to bridge larger, uneven mechanical gaps found within assemblies. Trust Songxi Technology for high-performance thermal solutions tailored to your specific requirements.

    Thermal Grease Series (1.5–6.0 W/m·K)

    At chip level, bond line thickness is critical. Songxi's thermal compound grease uses sub-micron conductive fillers in a shear-stable silicone matrix, spreading into microscopic surface textures and compressing to ultra-thin bonds under assembly pressure. As a thermal transfer grease, it resists pump-out under thermal cycling, remaining stable even after years at 150°C.

    Features

    • Ultra-low thermal resistance with sub-micron fillers
    • Anti-pump-out matrix for thermal cycle stability
    • Excellent wetting for void-free contact
    • Non-curing, stable at high temperatures
    • Rheology tuned for automated dispensing
    Thermal Conductive Grease Series
    Color White White White White White White White
    Thermal Conductivity (W/mK) 1.5 2.0 3.0 3.5 4.0 5.0 6.0
    Extrusion Rate (g/min) 75±15 75±15 30±5 30±5 30±5 25±5 15±5
    Density (g/cc) 2.3 2.5 3.0 3.0 3.1 3.2 3.3

    Applications

    industrial IGBT modules, EV power electronics (OBC, power drives), smart home mainboards, and high-frequency microprocessor packaging.

    Thermal Interface Materials – thermal grease for chip-level gaps & thermal pads for module-level uneven gaps (1)

    Thermal Conductive Pad Series (1.5–10.0 W/m·K)

    For full assemblies—BMS packs, inverters, multi-board enclosures—gaps are larger and less predictable. Songxi's thermal gap pads use a compliant low-hardness elastomer that deforms under low assembly force, filling uneven gaps without stressing components. As a thermal conductive silicone pad, it provides both thermal conduction and electrical isolation. Fiberglass reinforcement resists tearing, and low-volatile formulation limits oil bleeding.

    Features

    • Broad conductivity range (1.5–10.0 W/m·K)
    • High compressibility for large gaps
    • Low oil bleeding, protects nearby components
    • High dielectric isolation
    • Tear-resistant for automated assembly
    Thermal Conductive Pad Series
    Color Gray White Dark Gray Blue Pink Reddish Brown Gray Gray Gray Gray
    Thermal Conductivity (W/mK) 1.5 2.0 3.0 4.0 5.0 6.0 7.0 8.0 10.0
    Thickness (mm) 0.2-12 0.2-12 0.3-12 0.3-5.0 0.5-5.0 0.5-5.0 0.5-5.0 0.5-5.0 0.5-5.0
    Hardness (Shore 00) 30-90 30-90 30-90 30-90 60-90 60-90 50-80 50-80 50-80
    Density (g/cc) 2.1 2.3 2.9 3.2 3.0 3.3 3.4 3.4 3.4

    Applications

    automotive power modules (BMS, OBC), industrial control inverters, telecom hardware, and high-power smart home appliances.

    Thermal Interface Materials – thermal grease for chip-level gaps & thermal pads for module-level uneven gaps (2)

    Frequently Asked Questions

    What is the primary difference between thermal grease and thermal conductive pads?
    Thermal grease is optimized for chip-level, ultra-thin bond lines to minimize microscopic thermal resistance, while thermal pads are designed for larger, uneven gaps in full assemblies to provide both thermal conduction and electrical isolation.
    How does Songxi thermal grease resist pump-out during thermal cycling?
    The grease uses sub-micron conductive fillers suspended in a shear-stable silicone matrix, ensuring the compound remains non-curing, fully wetted, and structurally stable even after prolonged operation up to 150°C.
    What thermal conductivity options are available for these materials?
    The Thermal Grease series offers thermal conductivities ranging from 1.5 to 6.0 W/m·K, while the Thermal Conductive Pad series provides options from 1.5 up to 10.0 W/m·K.
    Are the thermal conductive silicone pads reinforced for automated handling?
    Yes, they feature fiberglass reinforcement that provides excellent tear resistance, facilitating automated assembly and die-cut placement without deformation.
    How do thermal pads prevent oil contamination on sensitive electronics?
    The pads are formulated with low-volatile silicone chemistry, significantly limiting silicone oil bleeding and safeguarding adjacent optical or electrical components.
    What typical industries utilize these thermal interface materials?
    They are widely applied in EV power electronics (OBC, power drives, BMS), industrial IGBT modules, inverter controllers, telecom hardware, and smart home appliances.

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