China Thermal Interface Materials Suppliers - Thermal Grease & Pads for Effective Cooling Solutions Factory
Thermal Grease Series (1.5–6.0 W/m·K)
At chip level, bond line thickness is critical. Songxi's thermal compound grease uses sub-micron conductive fillers in a shear-stable silicone matrix, spreading into microscopic surface textures and compressing to ultra-thin bonds under assembly pressure. As a thermal transfer grease, it resists pump-out under thermal cycling, remaining stable even after years at 150°C.
Features
Ultra-low thermal resistance with sub-micron fillers
Anti-pump-out matrix for thermal cycle stability
Excellent wetting for void-free contact
Non-curing, stable at high temperatures
Rheology tuned for automated dispensing
Specifications
| Thermal Conductive Pad Series | |||||||||
| Color | Gray White | Dark Gray | Blue | Pink | Reddish Brown | Gray | Gray | Gray | Gray |
| Thermal Conductivity (W/mK) | 1.5 | 2.0 | 3.0 | 4.0 | 5.0 | 6.0 | 7.0 | 8.0 | 10.0 |
| Thickness (mm) | 0.2-12 | 0.2-12 | 0.3-12 | 0.3-5.0 | 0.5-5.0 | 0.5-5.0 | 0.5-5.0 | 0.5-5.0 | 0.5-5.0 |
| Hardness (Shore 00) | 30-90 | 30-90 | 30-90 | 30-90 | 60-90 | 60-90 | 50-80 | 50-80 | 50-80 |
| Density (g/cc) | 2.1 | 2.3 | 2.9 | 3.2 | 3.0 | 3.3 | 3.4 | 3.4 | 3.4 |
Applications
Applications
industrial IGBT modules, EV power electronics (OBC, power drives), smart home mainboards, and high-frequency microprocessor packaging.
Thermal Conductive Pad Series (1.5–10.0 W/m·K)
For full assemblies—BMS packs, inverters, multi-board enclosures—gaps are larger and less predictable. Songxi's thermal gap pads use a compliant low-hardness elastomer that deforms under low assembly force, filling uneven gaps without stressing components. As a thermal conductive silicone pad, it provides both thermal conduction and electrical isolation. Fiberglass reinforcement resists tearing, and low-volatile formulation limits oil bleeding.
Features
Broad conductivity range (1.5–10.0 W/m·K)
High compressibility for large gaps
Low oil bleeding, protects nearby components
High dielectric isolation
Tear-resistant for automated assembly
Specifications
| Thermal Conductive Grease Series | |||||||
| Color | White | White | White | White | White | White | White |
| Thermal Conductivity (W/mK) | 1.5 | 2.0 | 3.0 | 3.5 | 4.0 | 5.0 | 6.0 |
| Extrusion Rate (g/min) | 75±15 | 75±15 | 30±5 | 30±5 | 30±5 | 25±5 | 15±5 |
| Density (g/cc) | 2.3 | 2.5 | 3.0 | 3.0 | 3.1 | 3.2 | 3.3 |
Applications
Applications
automotive power modules (BMS, OBC), industrial control inverters, telecom hardware, and high-power smart home appliances.
Frequently Asked Questions (FAQ)
Q: What is the difference between thermal grease and thermal pads?
Thermal grease is optimized for chip-level, ultra-thin bond line thickness to fill microscopic surface roughness, whereas thermal conductive pads are designed for larger, uneven gap filling across full assemblies with built-in dielectric isolation.
Q: How does Songxi thermal grease resist pump-out effects?
It employs sub-micron conductive fillers within a shear-stable silicone matrix, remaining chemically and structurally stable under repeated thermal cycling even after long-term exposure to 150°C.
Q: What thermal conductivity levels are available?
The thermal grease series offers thermal conductivities ranging from 1.5 to 6.0 W/m·K, while the thermal conductive pad series supports high-performance cooling demands from 1.5 up to 10.0 W/m·K.
Q: Do thermal gap pads prevent oil bleeding?
Yes, our thermal pads feature a low-volatile formulation designed to minimize silicone oil bleeding, protecting sensitive electronic components and neighboring circuit boards.
Q: Are these thermal interface materials compatible with automated manufacturing?
Yes, the thermal grease is rheology-tuned for high-speed automated dispensing, and the thermal pads are reinforced with fiberglass to resist tearing during automated placement.
