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Precision-formulated polymer systems designed for high-tensile holding, sub-micron passive/active alignment retention, and advanced electromagnetic compatibility.
As the telecommunications and data communication industries transition from traditional QSFP28 (100G) modules to 400G DR4/FR4, 800G OSFP, and 1.6T Co-Packaged Optics (CPO) architectures, optoelectronic adhesive technology has become the core determinant of yield, optical loss, and long-term signal fidelity.
In single-mode fiber (SMF) and silicon photonic waveguides, a mechanical drift of just 0.5 μm during or after curing can result in an optical coupling loss exceeding 2 dB to 3 dB. Modern optical epoxies utilize heavily crosslinked, nanoparticle-filled polymer networks that keep linear curing shrinkage below 0.1% to 0.3%, locking active alignment components precisely in place.
Volatile organic condensation onto laser diode facets, photodiode active windows, or micro-lenses causes catastrophic optical degradation and thermal runaway. Specialized optical epoxies ensure Total Mass Loss (TML) < 0.5% and Collected Volatile Condensable Material (CVCM) < 0.05% compliant with ASTM E-595 and Telcordia GR-468-CORE standards.
Optical transceivers undergo extreme temperature cycling from -40°C to +85°C (industrial grade up to 105°C). By tailoring the Coefficient of Thermal Expansion (CTE α1 between 18 to 35 ppm/°C) and elevating Glass Transition Temperatures (Tg > 120°C–160°C), our epoxies avoid substrate warping, micro-cracking, and delamination between dissimilar materials.
Precision adhesive dispensing covers every level of optoelectronic module manufacturing, from micro-optical sub-assemblies (OSA) to outer housing environmental barriers.
In Transmitter Optical Sub-Assemblies (TOSA), collimating lenses, focusing lenses, and beam splitters are actively adjusted under live power monitoring. Fast UV-cure cationic or free-radical epoxies provide instantaneous initial hold (tack cure in 2–5 seconds), followed by secondary thermal cure in shadowed zones, ensuring zero optical drift during mass production.
Silicon Photonic Photonic Integrated Circuits (PICs) rely on micro-machined V-groove Fiber Arrays (FAU) or grating couplers. Our ultra-low expansion optical grade structural epoxies offer superior refractive index matching, high mechanical peel strength, and resistance to environmental moisture ingress, preserving multi-channel optical channel consistency.
Optical headers (TO-can, Box packaging) require rugged barriers against ambient humidity, preventing moisture-induced laser facet oxidation and gold-wire bonding corrosion. Epoxy adhesives engineered with high glass transition points and extreme moisture resistance provide dependable semi-hermetic to near-hermetic containment throughout long product lifespans.
Wavelength Division Multiplexing (CWDM/LAN-WDM/DWDM) requires multi-cavity dielectric optical thin-film filters, polarizers, and prisms to be mechanically secured with minimal stress. Low-modulus or controlled-modulus epoxy adhesives absorb mechanical shocks while maintaining tight angular tolerances over harsh temperature extremes.
Selecting the appropriate resin chemistry based on curing mechanism, volumetric shrinkage, outgassing rate, and joint rigidity.
| Adhesive Category | Curing Mechanism | Volumetric Shrinkage | Tg (°C) / CTE (α1) | NASA Outgassing (CVCM) | Primary Optical Transceiver Application |
|---|---|---|---|---|---|
| Dual-Cure UV / Thermal Epoxy | UV Tack (365nm) + Heat (80°C–120°C) | < 0.15% | 145°C / 24 ppm/°C | < 0.03% (Passed) | Active alignment of TOSA/ROSA micro-lenses & PIC FAU coupling |
| Fast Thermal Cure Epoxy (Single-Part) | Heat (100°C–150°C) in 5–15 mins | < 0.35% | 160°C / 30 ppm/°C | < 0.04% (Passed) | Die attach, optical filter slotting, isolator micro-positioning |
| Optical Grade UV Cationic Adhesive | Pure UV Irradiation (Deep Dark Cure) | < 0.20% | 130°C / 38 ppm/°C | < 0.05% (Passed) | Optical clear bonding, lens barrel fixation, fiber sleeve potting |
| Conductive / Shielding Epoxy | Thermal Curing (Silver/Carbon Filled) | < 0.40% | 110°C / 42 ppm/°C | < 0.08% (Passed) | Optical module shell grounding, EMI shielding (>60dB) |
| High Thermal Conductive Adhesive | Room Temp / Mild Heat | < 0.30% | 125°C / 28 ppm/°C | < 0.05% (Passed) | Laser diode submount heat dissipation, thermoelectric cooler (TEC) bonding |
Songxi Technology is a high-tech enterprise specializing in the R&D, production, and sales of electronic adhesives. Based on silicone, polyurethane, acrylic, and epoxy systems, we provide reliable bonding, sealing, and protection solutions for power electronics, optoelectronics, new energy, automotive, and aerospace industries.
We are committed to becoming a trusted provider of functional polymer material solutions for the electronics industry. Through continuous innovation and application development, we promote the localization of high-end electronic adhesives and help intelligent devices achieve greater stability and durability.
Comprehensive chemical engineering competencies delivering both standardized adhesives and fully customized formulations.
Songxi's business covers three functional areas: adhesive & sealing, potting & protection, and thermal interface materials. Our product portfolio includes PCBA fixing adhesives, UV adhesives, sealants, thermal conductive potting compounds, thermal greases, pads, two-component thermal gels, EMI shielding sealants, and reactive hot melt adhesives.
Our products serve power batteries, photovoltaic modules, drones, automotive electronics, 5G communications, and LED lighting. We provide both standard products and customized solutions for applications such as BMS conformal coating, IGBT thermal filling, and power battery structural bonding, supported by extensive technical experience and application expertise.
Led by a Ph.D. in Polymer Materials from Sichuan University, Songxi's R&D team has nearly twenty years of silicone application experience and has participated in over 100 product development projects. We maintain cooperation with research institutions including Chenguang Chemical Research Institute, Sichuan University, and Beijing Institute of Technology.
Certified with ISO9001, Songxi operates a comprehensive management system covering procurement, production, inspection, and after-sales service. Our products comply with RoHS and REACH requirements, with SGS verification and UL 94 V-0 flame retardant certification, ensuring consistent quality and reliable delivery.
Browse our high-performance electronic adhesives for optoelectronic coupling, PCBA component protection, automotive housing sealing, and airborne electronic systems.
Songxi adheres to integrity and quality throughout material selection, production, and delivery, turning reliability into a competitive advantage and earning long-term customer trust through professional service and continuous improvement across global markets.