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High Dielectric Strength Polyurethane Potting Compound ≥25kV/mm from China Suppliers and Factory for Transformers

Introducing our advanced two-component electronic potting compound, available in silicone, epoxy, or polyurethane bases. Manufactured in China, our products are designed to meet the highest quality standards and are supplied directly from our state-of-the-art factory. Featuring fixed-ratio mixing, our potting compound cures non-corrosively, ensuring complete deep-section curing without thick-layer under-cure or harmful acidic by-products. Our range includes formulations from rigid to low-stress elastic grades, strategically engineered to accommodate CTE mismatches, effectively preventing cracking and water ingress during thermal cycling. As a premium ceramic potting compound, it boasts a dielectric strength of ≥25 kV/mm, making it ideal for high-voltage PDUs and instrument transformers. It's also perfectly suited for automotive power battery PDUs and industrial motor transformers. Please note that mixing ratio, uniformity, and curing conditions significantly influence insulation and vibration resistance, ensuring optimal performance in demanding applications. Trust our reliable China suppliers and factory for your electronic potting compound needs.

    Product Introduction

    Outdoor LED displays endure year-round sun and rain. Underwater lights operate while fully submerged. Automotive ballasts run in engine bay heat and vibration. Washing machine mainboards face frequent moisture exposure. These applications demand far more from potting materials than standard electronics. When adhesion weakens, waterproofing fails, or the potting layer cracks with age, the consequences range from malfunction to complete unit failure. Songxi Technology's two-component electronic potting compound series was developed specifically to address these challenges.

    On the production line, the first obstacle is often insufficient flowability to completely fill the tiny gaps around PCBs, transformers, inductors, and IC chips—leaving trapped air bubbles that cause uneven heat dissipation and partial discharge. This series delivers low viscosity and excellent leveling, allowing thorough penetration into every corner of the component assembly to achieve complete, bubble-free, void-free potting. As a low density potting silicone, it reduces both potting costs and product weight, making it especially practical for power supply designs pursuing lightweighting goals.

    For high-volume production, the working window of the potting material directly impacts line efficiency. This series offers ample working time after mixing and is compatible with automated potting lines, allowing seamless continuous potting and vacuum degassing in batch operations. After curing, it forms an elastomeric structure combining support with flexibility, protecting solder joints and pins from mechanical stress during transport and field use.

    Long-term reliability of potted products depends on two critical factors: sealing and heat dissipation. This series offers excellent adhesion and outstanding outdoor waterproofing and moisture protection, with weatherability that holds up over years of outdoor service. As a lightweight flame retardant silicone, it carries UL94 V-0 certification, effectively containing risk propagation under fault conditions such as abnormal heating or short circuits. With adjustable thermal conductivity from 1.0 to 3.5W/m·K, it efficiently conducts heat from internal components to the housing, reducing temperature rise and slowing thermal aging. It has passed rigorous reliability testing including high-temperature aging and thermal shock, with no cracking, no debonding, and no performance degradation—meeting the demands of harsh environments including outdoor exposure, high humidity, and salt spray.

    On safety and compliance, this series carries UL94 V-0 flame retardant certification, effectively containing risk propagation under fault conditions such as abnormal heating or short circuits, helping meet safety requirements for exported power supplies and high-end electronic equipment. It also complies with RoHS environmental directives, is non-toxic and non-corrosive. No primer is required, it cleans easily after dispensing, and as a reenterable potting compound, cured products can be disassembled for rework—details that significantly reduce total cost in high-volume production and after-sales maintenance.

    From LED displays and underwater lights to automotive ballasts, surge protection modules, and washing machine mainboards, this series has been widely adopted across diverse waterproof electronic product applications. With mature formulations, stable batch-to-batch production capability, and comprehensive certifications, it is helping more manufacturers improve product quality, reduce rework rates, and strengthen market competitiveness.

    Features

    Two-component system with low viscosity and excellent leveling
    Low-density formulation for lower cost and reduced weight
    Thermal conductivity from 1.0 to 3.5W/m·K
    Elastomeric structure with vibration, shock, and deformation resistance
    Good substrate compatibility with excellent adhesion
    Effective outdoor waterproofing and moisture protection with excellent weatherability
    No primer required, easy to clean, easy to disassemble after curing
    UL94 V-0 flame retardant, compliant with RoHS environmental requirements

    Specifications

    Model Color Mix Ratio (by weight) Mixed Viscosity Specific Gravity Working Time @25°C Thermal Conductivity
    DR8522 Series Black / White 1:1 3000±500 mPa·s 1.55±0.1 g/ml 30-60 min 0.6 W/(m·K)
    Black / White 1:1 3500±1000 mPa·s 1.85±0.1 g/ml 30-60 min 1.0 W/(m·K)
    Black / White 1:1 3500±1000 mPa·s 2.45±0.1 g/ml 30-60 min 1.5 W/(m·K)
    Black / White 1:1 5500±1000 mPa·s 2.75±0.1 g/ml 30-60 min 2.0 W/(m·K)
    Black / White 1:1 12000±2000 mPa·s 2.95±0.1 g/ml 30-60 min 3.0 W/(m·K)
    Black / White 1:1 25000±3000 mPa·s 3.15±0.2 g/ml 30-60 min 4.0 W/(m·K)

    Application

    Potting protection for LED displays, underwater lights, buried lights, automotive ballasts, surge protection modules, washing machine mainboards, and other waterproof electronic products.

    Frequently Asked Questions

    Q What applications is this electronic potting compound primarily designed for?

    It is engineered for demanding waterproof and outdoor electronics, including outdoor LED displays, underwater lights, buried lights, automotive ballasts, surge protection modules, and washing machine mainboards.

    Q How does this potting material eliminate voiding and air bubbles during assembly?

    The two-component system features low mixed viscosity and excellent self-leveling performance, allowing thorough penetration into narrow spaces around PCBs, transformers, and ICs for complete, bubble-free potting.

    Q What are the thermal conductivity options available for the DR8522 series?

    The DR8522 series offers adjustable thermal conductivity ranging from 0.6 W/(m·K) up to 4.0 W/(m·K), efficiently conducting heat away from critical internal components to prevent thermal aging.

    Q Can cured electronics be disassembled or reworked after potting?

    Yes. As a reenterable potting compound with an elastomeric structure, cured products can be disassembled for rework and repair, significantly reducing total costs during production and after-sales service.

    Q Is primer needed before dispensing, and what safety certifications does it meet?

    No primer is required. The material carries UL94 V-0 flame retardant certification, complies fully with RoHS environmental directives, and is non-toxic and non-corrosive.

    Q Is this potting compound suitable for automated dispensing lines?

    Yes. With a generous 30–60 minute working time at 25°C and stable flowability, it is fully compatible with automated dispensing machines and batch vacuum degassing operations.

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