Inquiry
Form loading...
Discover high-performance thermal pads, structural adhesives, and potting gels precision-formulated to resolve critical heat dissipation bottlenecks in high-density electronic assemblies.
Engineered for microscopic chip-level interfaces and macro module-level uneven gaps. Delivers minimal thermal resistance and exceptional surface wet-out across broad thermal cycles.
Explore Specifications
Designed for high-reliability circuit boards to prevent solder pad electrochemical migration, resist mechanical shock, and secure heavy power components in automotive inverters.
Explore Specifications
Automated dispensing silicone gel with superior flowability, deep section cure, and high dielectric breakdown resistance for EV battery modules and onboard chargers.
Explore Specifications
Ultra-low hardness (Shore 00 15–40) silicone gap fillers engineered with fiberglass reinforcement for high-stress aerospace enclosures, AI server blades, and telecommunication basestations.
Explore SpecificationsAn overview of how reshoring manufacturing, clean energy legislation, and artificial intelligence computing are driving advanced Thermal Interface Material (TIM) adoption across North America.
Accelerated by the US Inflation Reduction Act (IRA), battery gigafactories across Michigan, Ohio, Tennessee, and Georgia require high-durability thermal pads and potting gels to mitigate thermal runaway in 800V silicon carbide (SiC) powertrains, liquid-cooled pack cold plates, and high-voltage Battery Management Systems (BMS).
In technological hubs like Silicon Valley, Northern Virginia, and Texas, high-density AI accelerators (GPU/TPU clusters) generating upwards of 700W per socket require ultra-thin, low-thermal-resistance phase change materials and 8.0–15.0 W/m·K gap pads that eliminate thermal pumping and outgassing under continuous processing loads.
US defense contractors and commercial space innovators require silicone and non-silicone thermal interface solutions adhering to NASA SP-R-0022A outgassing standards (CVCM < 0.1%, TML < 1%) to protect sensitive optoelectronic sensors, radar transceiver T/R modules, and satellite avionics from extreme thermal vacuum cycling.
Songxi Technology is a high-tech enterprise specializing in the R&D, production, and sales of electronic adhesives. Based on silicone, polyurethane, acrylic, and epoxy systems, we provide reliable bonding, sealing, and protection solutions for power electronics, optoelectronics, new energy, automotive, and aerospace industries.
We are committed to becoming a trusted provider of functional polymer material solutions for the electronics industry. Through continuous innovation and application development, we promote the localization of high-end electronic adhesives and help intelligent devices achieve greater stability, durability, and superior thermal efficiency across global and US manufacturing markets.
Engineered polymeric formulations tailored for precision dispensing, automated high-speed assembly, and extreme thermal resilience.
Songxi's business covers three functional areas: adhesive & sealing, potting & protection, and thermal interface materials. Our product portfolio includes PCBA fixing adhesives, UV adhesives, sealants, thermal conductive potting compounds, thermal greases, pads, two-component thermal gels, EMI shielding sealants, and reactive hot melt adhesives.
Our products serve power batteries, photovoltaic modules, drones, automotive electronics, 5G communications, and LED lighting. We provide both standard products and customized solutions for applications such as BMS conformal coating, IGBT thermal filling, and power battery structural bonding, supported by extensive technical experience and application expertise.
| Performance Metric | Standard Grade | High-Conductivity Grade | Ultra-Soft / Low-Stress |
|---|---|---|---|
| Thermal Conductivity (W/m·K) | 1.5 – 3.0 | 5.0 – 12.0+ | 2.0 – 6.0 |
| Hardness (Shore 00) | 45 – 65 | 50 – 70 | 15 – 35 |
| Dielectric Breakdown (kV/mm) | > 5.0 | > 8.0 | > 6.0 |
| Operating Temp Range (°C) | -40 to +150 | -50 to +180 | -60 to +200 |
| Flammability Rating | UL 94 V-0 | UL 94 V-0 | UL 94 V-0 |
| Testing Standard | ASTM D5470 | ASTM D5470 | ASTM D5470 |
Led by a Ph.D. in Polymer Materials from Sichuan University, Songxi's R&D team has nearly twenty years of silicone application experience and has participated in over 100 product development projects. We maintain cooperation with research institutions including Chenguang Chemical Research Institute, Sichuan University, and Beijing Institute of Technology.
Certified with ISO9001, Songxi operates a comprehensive management system covering procurement, production, inspection, and after-sales service. Our products comply with RoHS and REACH requirements, with SGS verification and UL 94 V-0 flame retardant certification, ensuring consistent quality and reliable delivery across the United States.
From initial CAD review and thermal modeling to rapid sample dispatch via air freight, our streamlined procurement process ensures transparent pricing and DDP delivery across all 50 US states.
Provide your mechanical drawings (CAD / DXF / STEP), target thermal conductivity (W/m·K), thickness range (0.25mm to 15.0mm), and operating environment parameters.
Our material PhDs match your thermal resistance, dielectric breakdown, and Shore 00 hardness criteria, selecting fiberglass carrier or single/double adhesive liners.
Receive an itemized FOB/DDP USD quotation within 24 hours. Custom die-cut prototype samples are prepared and dispatched to your US engineering facility within 3 to 5 business days.
Full automated die-cut production under ISO9001 compliance. We manage customs clearance and provide direct door-to-door delivery with full Certificate of Analysis (CoA) and RoHS/UL reports.
Browse our complete product matrix for advanced North American power, communications, and electronics manufacturing.
Formulated with ultra-fine ceramic fillers to deliver micro-gap thermal dissipation for CPU, GPU, and high-frequency ASIC packages with zero pump-out effect.
View Details
Engineered for dense SMT printed circuit boards, resisting humidity, ionic contamination, and electrical breakdown in outdoor 5G remote radio heads (RRU).
View Details
Low compression force, room or accelerated heat curing silicone gel ideal for high-volume automated robotic dispensing on EV battery pack cold plates.
View Details
Features an integrated fiberglass dielectric substrate to prevent puncture by component pins and reduce mechanical deformation during manual or automated assembly.
View Details
Solid at room temperature for easy handling and pre-application, softening at 45°C–55°C operating temperatures to achieve ultra-low bond-line thickness (BLT).
View Details
Instant UV pinning with secondary moisture cure for shadowed zones, offering robust environmental barrier protection for US smart grid sensors and industrial IoT controllers.
View Details
High-grade elastomeric potting compounds providing waterproof IP67/IP68 sealing, severe vibration damping, and fast heat transfer for outdoor solar micro-inverters.
View Details
100% silicone-free formulation eliminating silicone oil migration and siloxane volatility. Perfect for high-precision optical transceivers, automotive cameras, and aerospace lasers.
View DetailsSongxi adheres to integrity and quality throughout material selection, production, and delivery, turning reliability into a competitive advantage and earning long-term customer trust through professional service and continuous improvement across global markets.
Ready to optimize your device thermal performance, lower interface thermal impedance, and obtain a factory-direct competitive quotation for the US market? Our engineering team is standing by to assist with CAD reviews, test reports, and custom sample kits.