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High Strength Epoxy Adhesive For Optical Module Coupling Fixation And Sealing

Engineered Micro-Precision Polymer Systems Providing Sub-Micron Alignment Stability, Exceptional Structural Fixing, and Hermetic Reliability for Next-Generation Optoelectronic Transceivers

Market Dynamics & Optical Coupling Evolution

Meeting the ultra-dense packaging and rigorous reliability standards of 400G, 800G, and 1.6T transceiver architectures

The explosive expansion of artificial intelligence (AI) compute clusters, high-performance hyperscale data centers, and 5G/6G backhaul networks has triggered a generational paradigm shift in optical communication architectures. As transceivers scale rapidly from 100G and 400G towards 800G and 1.6T co-packaged optics (CPO) and pluggable modules (such as QSFP-DD and OSFP), the physical tolerances governing optical component alignment have contracted to sub-micron dimensions.

In modern Transmitter Optical Sub-Assemblies (TOSA), Receiver Optical Sub-Assemblies (ROSA), and Silicon Photonics (SiPh) hybrid coupling systems, even nanoscale positional deviations can cause severe optical insertion loss, modal dispersion, and link degradation. Consequently, high strength epoxy adhesives formulated specifically for optical coupling fixation and sealing are no longer passive bonding elements; they serve as critical, dimensionally stable structural matrixes designed to resist thermal shock, cyclic fatigue, and environmental aging throughout a multi-decade operational lifespan.

01

Near-Zero Volumetric Shrinkage

Formulated with advanced cycloaliphatic and aromatic epoxy resin matrices paired with ultra-fine spherical inorganic nano-fillers. This minimizes post-cure cure shrinkage (<0.2%), completely eliminating optical misalignment during UV and thermal post-curing cycles.

02

Ultra-Low Coefficient of Thermal Expansion (CTE)

Designed with CTE values tailored precisely below Tg (typically 18 to 30 ppm/°C) to prevent thermomechanical shear stress accumulation at the bond interfaces between dissimilar substrates like InP, GaAs, Silicon, glass ferrules, and metal kovar housings.

03

Strict NASA-Grade Low Outgassing

Exceeds NASA SP-R-0022A and Telcordia GR-1221-CORE outgassing benchmarks with Total Mass Loss (TML) < 1.0% and Collected Volatile Condensable Material (CVCM) < 0.05%, preventing volatile condensation on micro-lenses, laser facets, and photodiode active windows.

Critical In-Depth Application Scenarios

Comprehensive encapsulation, bonding, and structural sealing across micro-optical sub-assemblies

1. Active & Passive Fiber Array (FA) to PIC Coupling

In Photonic Integrated Circuits (PIC) and Silicon Photonics engines, Fiber Arrays (FA) must couple directly to edge couplers or grating couplers. Our high-strength epoxy offers optimized rheology with thixotropic control, ensuring controlled capillary flow without spreading into critical optical paths. The rapid dual-cure mechanism (fast UV tacking followed by low-temperature thermal curing) provides immediate fixation within 3 to 5 seconds during active alignment, followed by deep thermal curing that crosslinks hidden shaded zones.

2. TOSA/ROSA Lens and Isolator Structural Sealing

Within TOSA/ROSA packages, collimating lenses, optical isolators, and beamsplitter prisms experience continuous mechanical vibration and cyclic thermal gradients ranging from -40°C to +85°C. The adhesive exhibits high glass transition temperatures (Tg > 140°C) and superior tensile shear strength (> 22 MPa on stainless steel, gold-plated substrates, and ceramic ferrules), offering an unyielding mechanical anchor that withstands 1000+ thermal shock cycles without micro-cracking.

3. Hermetic and Semi-Hermetic Shell Perimeter Sealing

Moisture ingress and atmospheric contaminants are leading contributors to internal laser diode corrosion and wire bond degradation. High-strength epoxy sealing adhesives offer high barrier resistance to water vapor transmission (WVTR) and aggressive gases. Their excellent wetting properties across nickel-plated, kovar, and aluminum surfaces ensure void-free seal lines along transceiver chassis joints, meeting strict Telcordia reliability requirements.

Parameter Benchmark Coupling Fixation Epoxy Standard Peripheral Sealing Epoxy Standard
Curing Chemistry Dual-Cure (UV Cationic/Free Radical + Thermal) Thermal Cure / Dual-Cure Epoxy
Linear Shrinkage (%) ≤ 0.15% ≤ 0.35%
Glass Transition Temp (Tg) 130°C ~ 165°C 120°C ~ 150°C
Shear Strength (Al-Al) ≥ 20 MPa ≥ 18 MPa
Thermal Shock (-40°C ~ +85°C) Pass 1000 Cycles (No optical loss shift) Pass 1000 Cycles (No hermetic leakage)
Telcordia GR-1209/1221 Compliance Fully Qualified Fully Qualified

Our Mission & Company Overview

Songxi Technology is a high-tech enterprise specializing in the R&D, production, and sales of electronic adhesives. Based on silicone, polyurethane, acrylic, and epoxy systems, we provide reliable bonding, sealing, and protection solutions for power electronics, optoelectronics, new energy, automotive, and aerospace industries.

We are committed to becoming a trusted provider of functional polymer material solutions for the electronics industry. Through continuous innovation and application development, we promote the localization of high-end electronic adhesives and help intelligent devices achieve greater stability and durability.

Songxi Technology Manufacturing Facility

Our Business Capacities

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Core Business Portfolio

Songxi's business covers three functional areas: adhesive & sealing, potting & protection, and thermal interface materials. Our product portfolio includes PCBA fixing adhesives, UV adhesives, sealants, thermal conductive potting compounds, thermal greases, pads, two-component thermal gels, EMI shielding sealants, and reactive hot melt adhesives.

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Customized Products & Formulation

Our products serve power batteries, photovoltaic modules, drones, automotive electronics, 5G communications, and LED lighting. We provide both standard products and customized solutions for applications such as BMS conformal coating, IGBT thermal filling, and power battery structural bonding, supported by extensive technical experience and application expertise.

R&D Excellence And Quality Assurance

Led by industry Ph.D. leadership, state-of-the-art analytical equipment, and rigorous international quality certifications

Led by a Ph.D. in Polymer Materials from Sichuan University, Songxi's R&D team has nearly twenty years of silicone application experience and has participated in over 100 product development projects. We maintain cooperation with research institutions including Chenguang Chemical Research Institute, Sichuan University, and Beijing Institute of Technology.

Certified with ISO9001, Songxi operates a comprehensive management system covering procurement, production, inspection, and after-sales service. Our products comply with RoHS and REACH requirements, with SGS verification and UL 94 V-0 flame retardant certification, ensuring consistent quality and reliable delivery.

Enduring Excellence in Advanced Electronic Encapsulation

Songxi adheres to integrity and quality throughout material selection, production, and delivery, turning reliability into a competitive advantage and earning long-term customer trust through professional service and continuous improvement across global markets.