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Tailored high-performance epoxy and adhesive systems designed to protect mission-critical drone electronics against high thermal loads, partial discharge, and extreme humidity.
Modern unmanned aerial vehicles (UAVs), electric vertical takeoff and landing (eVTOL) aircraft, and industrial drones place unprecedented stress on Electronic Speed Controllers (ESCs).
Modern ESCs switch currents upwards of 60A to 200A+ per channel within miniaturized multi-layer PCB footprints. Silicon and GaN/SiC MOSFET junctions generate severe localized hot spots exceeding 130°C. Standard conformal coatings degrade rapidly, while high-temperature thermally conductive epoxy acts as a 3D heat conduit directly transferring heat to the outer aluminum casing or airflow boundaries.
Agricultural spraying drones endure daily exposure to corrosive fertilizers, pesticides, and high-pressure water washdown. Industrial inspection UAVs operate in driving rain and maritime salt mist. Fully encapsulated epoxy potting creates an impenetrable, hermetic barrier that completely eliminates moisture ingress, dendritic growth, and galvanic corrosion on solder pads.
With high-voltage drone battery architectures shifting from 6S (25.2V) to 12S-24S (50V-100V+), transient voltage spikes can induce dielectric breakdown and partial discharge in micro-voids. Thermally conductive epoxies with superior dielectric strength (>20 kV/mm) and low shrinkage ensure long-term electrical insulation under high dynamic motor back-EMF.
FPV racing drones, military loitering munitions, and heavy-lift logistics UAVs experience violent motor vibrations and sudden G-force impacts. Unfilled air cavities leave tall electrolytic capacitors and surface-mount inductors vulnerable to solder joint fatigue. High-strength potting epoxy provides robust mechanical support, absorbing vibrational kinetic energy and extending MTBF (Mean Time Between Failures).
Mismatches in the Coefficient of Thermal Expansion (CTE) between the potting compound, copper traces, and ceramic electronic packages can cause micro-cracking during rapid thermal cycling (e.g., cold high-altitude flight to ground-level full-throttle climbs). Optimized epoxy formulations match CTE properties to prevent delamination and solder shear.
The rapid expansion of commercial drone operations demands automotive- and aerospace-grade encapsulation standards for all power electronic assemblies.
While thin-film conformal coatings provide baseline dust protection, they fail to dissipate heat away from high-power field-effect transistors (FETs) and cannot prevent moisture ingress when subjected to water immersion. Industrial drone OEMs are systematically transitioning to two-component thermally conductive epoxy potting systems to achieve IP68 waterproof ratings and double ESC power throughput without increasing PCB surface area.
Songxi Technology continues to lead this transition by engineering ultra-low viscosity, high thermal conductivity epoxy formulations that penetrate tight under-component clearances before curing into a tough, thermally conductive armor.
Typical physical and electrical characteristics of high-temperature thermally conductive epoxy for drone ESC mainboard potting.
| Parameter | Test Method | Standard ESC Epoxy Spec | Ultra-Performance Grade |
|---|---|---|---|
| Thermal Conductivity (W/m·K) | ASTM D5470 / Hot Disk | 1.2 – 1.8 W/m·K | 2.5 – 3.5 W/m·K |
| Continuous Operating Temperature | IEC 60216 | -40°C to +150°C | -55°C to +180°C |
| Viscosity (Mixed at 25°C) | Brookfield (mPa·s) | 2,500 – 4,500 cP (Self-leveling) | 1,200 – 2,800 cP (Deep Penetration) |
| Dielectric Strength (kV/mm) | ASTM D149 (1mm thickness) | ≥ 18 kV/mm | ≥ 25 kV/mm |
| Flame Retardancy Rating | UL 94 | UL 94 V-0 Equivalent | Certified UL 94 V-0 (0.8mm) |
| Water Absorption (24h at 23°C) | ASTM D570 | < 0.15% | < 0.05% (Hermetic Seal) |
| Glass Transition Temp (Tg) | DSC (ASTM E1356) | ≥ 110°C | ≥ 145°C |
| Shore Hardness | ASTM D2240 | Shore D 70 – 85 | Shore D 75 – 90 |
Songxi Technology is a high-tech enterprise specializing in the R&D, production, and sales of electronic adhesives. Based on silicone, polyurethane, acrylic, and epoxy systems, we provide reliable bonding, sealing, and protection solutions for power electronics, optoelectronics, new energy, automotive, and aerospace industries.
We are committed to becoming a trusted provider of functional polymer material solutions for the electronics industry. Through continuous innovation and application development, we promote the localization of high-end electronic adhesives and help intelligent devices achieve greater stability and durability.
Delivering end-to-end adhesive and thermal management capabilities across key high-reliability electronics sectors.
Songxi's business covers three functional areas: adhesive & sealing, potting & protection, and thermal interface materials. Our product portfolio includes PCBA fixing adhesives, UV adhesives, sealants, thermal conductive potting compounds, thermal greases, pads, two-component thermal gels, EMI shielding sealants, and reactive hot melt adhesives.
Our products serve power batteries, photovoltaic modules, drones, automotive electronics, 5G communications, and LED lighting. We provide both standard products and customized solutions for applications such as BMS conformal coating, IGBT thermal filling, and power battery structural bonding, supported by extensive technical experience and application expertise.
Achieving void-free thermal encapsulation and consistent IP68 sealing requires optimized dispensing parameters and surface preparation.
Ensure the ESC PCBA is free of flux residues, moisture, and oils. Atmospheric plasma treatment on high-temperature FR4 and copper contact pads increases surface energy, ensuring chemical cross-linking and eliminating micro-leak paths along solder masks.
Two-component thermally conductive epoxy (Resin + Hardener) must be precisely proportioned using dynamic or static automated mixing nozzles. Inline vacuum degassing removes micro-bubbles introduced during mixing, guaranteeing complete dielectric integrity.
Employ a low-temperature initial gel phase (e.g., room temp or 50°C) to facilitate complete underfill penetration under BGA and MOSFET packages, followed by a post-cure (80°C - 100°C) to maximize glass transition temperature (Tg) and thermal conductivity.
Led by a Ph.D. in Polymer Materials from Sichuan University, Songxi's R&D team has nearly twenty years of silicone application experience and has participated in over 100 product development projects. We maintain cooperation with research institutions including Chenguang Chemical Research Institute, Sichuan University, and Beijing Institute of Technology.
Certified with ISO9001, Songxi operates a comprehensive management system covering procurement, production, inspection, and after-sales service. Our products comply with RoHS and REACH requirements, with SGS verification and UL 94 V-0 flame retardant certification, ensuring consistent quality and reliable delivery.
As wide-bandgap semiconductors (GaN & SiC) replace standard silicon in drone inverters, switching frequencies continue to rise into the megahertz range. Next-generation epoxies combine spherical alumina and boron nitride ceramic micro-fillers to deliver thermal conductivities over 3.5 W/m·K while maintaining low viscosity and ultra-lightweight density to maximize aircraft flight endurance.
Songxi adheres to integrity and quality throughout material selection, production, and delivery, turning reliability into a competitive advantage and earning long-term customer trust through professional service and continuous improvement across global markets.
Explore our complete range of high-dielectric, thermally conductive, EMI-shielding, and structural adhesives engineered for drone ESCs, flight controllers, and avionics.
