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Next-Gen Automotive EV / HEV Solutions

Non Conductive Epoxy For PCB: Automotive BMS Chip Thermal Dissipation

High-dielectric insulation, ultra-low thermal resistance, and mission-critical thermal management for 800V EV architectures, microcontroller units (MCUs), and cell monitoring Analog Front-End (AFE) chips.

Specialized PCB Thermal Formulations

High-Performance BMS Heat Dissipation Solutions

Engineered to mitigate hotspot accumulation across high-density automotive printed circuit boards without risking electrical breakdown.

Engineering Excellence

Why Non-Conductive Thermal Epoxy is Critical for Automotive BMS

In high-voltage Electric Vehicle (EV) platforms shifting from 400V to 800V architectures, Battery Management Systems (BMS) endure extreme electrical fields and intense thermal flux. Non-conductive epoxy bridges the thermal gap without creating electrical leakage paths.

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>25 kV/mm Dielectric

Eliminates arcing, partial discharge, and micro-short risks between dense PCB traces under high-voltage transients.

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Thermal Transfer

Filled with spherical aluminum oxide & boron nitride to ensure anisotropic/isotropic thermal conductivity up to 3.5 W/m·K.

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CTE Matching

Tailored Coefficient of Thermal Expansion matches copper, FR4, and silicon substrates to prevent solder joint fatigue.

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AEC-Q & UL94 V-0

Certified flame retardancy and long-term resistance to automotive automotive thermal cycling (-40°C to +150°C).

Thermal Management in 800V High-Power Packs

Modern Battery Management Systems must continuously calculate State of Charge (SOC), State of Health (SOH), and monitor millivolt-level cell deviations. High-speed Analog Front-End (AFE) ICs and balance switches generate concentrated heat. Using thermally conductive, non-conductive epoxy provides direct thermal pathways from chip packages to the cooling plate or enclosure without risking busbar-to-ground short circuits.

Vibration Dampening & Structural Stability

Automotive PCBA units are subjected to multi-axis mechanical shock, vibration, and thermal expansion strains. Unlike traditional thermal pads that experience pumping-out or drying, thermosetting non-conductive epoxies cure into a rigid or semi-flexible matrix that locks components in place, safeguarding brittle solder balls against shear stress.

Harsh Chemical & Environmental Sealing

Exposed to condensation, battery electrolyte vapors, flux residues, and temperature swings, exposed PCB traces degrade rapidly. Applying an insulating, thermally dissipative epoxy layer prevents electrochemical migration (ECM), dendritic growth, and corrosion across fine-pitch IC leads.

About Songxi Technology

Our Mission

Songxi Technology is a high-tech enterprise specializing in the R&D, production, and sales of electronic adhesives. Based on silicone, polyurethane, acrylic, and epoxy systems, we provide reliable bonding, sealing, and protection solutions for power electronics, optoelectronics, new energy, automotive, and aerospace industries.

We are committed to becoming a trusted provider of functional polymer material solutions for the electronics industry. Through continuous innovation and application development, we promote the localization of high-end electronic adhesives and help intelligent devices achieve greater stability and durability.

Songxi Technology R&D Laboratory and Production Facility
Comprehensive Material Engineering

Our Business

Pioneering specialized adhesive formulations for the world's most demanding automotive, industrial, and energy storage ecosystems.

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Core Business

Songxi's business covers three functional areas: adhesive & sealing, potting & protection, and thermal interface materials. Our product portfolio includes PCBA fixing adhesives, UV adhesives, sealants, thermal conductive potting compounds, thermal greases, pads, two-component thermal gels, EMI shielding sealants, and reactive hot melt adhesives.

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Customized Products

Our products serve power batteries, photovoltaic modules, drones, automotive electronics, 5G communications, and LED lighting. We provide both standard products and customized solutions for applications such as BMS conformal coating, IGBT thermal filling, and power battery structural bonding, supported by extensive technical experience and application expertise.

Engineering Specifications

Material Property Comparison for Automotive BMS Thermal Design

Evaluating the electrical insulation and thermodynamic characteristics of polymer matrix chemistries in EV battery management systems.

Property / Parameter Songxi Non-Conductive Epoxy Standard Thermal Grease Silicone RTV Gel Polyurethane Potting
Thermal Conductivity (W/m·K) 1.5 – 3.5 W/m·K 1.0 – 4.0 W/m·K 1.0 – 2.5 W/m·K 0.8 – 1.8 W/m·K
Dielectric Strength (kV/mm) > 22 – 28 kV/mm < 5 – 10 kV/mm (Unstable) 18 – 22 kV/mm 15 – 20 kV/mm
Volume Resistivity (Ω·cm) ≥ 1.0 × 1015 1.0 × 1011 1.0 × 1014 1.0 × 1013
Mechanical Bonding Strength High Structural Shear (>15 MPa) Non-bonding (0 MPa) Low Elastic Tack (<2 MPa) Moderate Bond (5–8 MPa)
Siloxane Outgassing Risk Zero (100% Silicone-Free) High (Risk to relay contacts) Medium to High Zero
Automotive Thermal Shock (-40 to +150°C) Passes AEC-Q200 Grade 0/1 Prone to pump-out & dry-out High stability, soft matrix Degrades above 125°C

Key Application Scenarios in Automotive BMS Architecture

1. Cell Monitoring Unit (CMU) Slave Boards: Installed directly above battery cell groups, CMU boards run multi-channel balancing resistors that release substantial localized joule heat during fast charging cycles. Songxi's non-conductive epoxy acts as a heat spreader, routing heat efficiently to the module casing while insulating high-voltage cell poles.

2. Master Control Board (BMU) Processing Units: Houses high-frequency processors, ISO SPI communication modules, and power conversion ICs. High-dielectric epoxy ensures that signal traces operating at high bitrates do not experience capacitive distortion or parasitic leakage.

3. High-Voltage Relay & Pyro-Fuse Interconnects: Thermal interface epoxies prevent thermal runaway triggering in sensing shunts and high-current contactor junctions, ensuring long-term functional safety according to ISO 26262 ASIL-D standards.

Scientific Innovation & ISO Standards

R&D And Quality

Led by a Ph.D. in Polymer Materials from Sichuan University, Songxi's R&D team has nearly twenty years of silicone application experience and has participated in over 100 product development projects. We maintain cooperation with research institutions including Chenguang Chemical Research Institute, Sichuan University, and Beijing Institute of Technology.

Certified with ISO9001, Songxi operates a comprehensive management system covering procurement, production, inspection, and after-sales service. Our products comply with RoHS and REACH requirements, with SGS verification and UL 94 V-0 flame retardant certification, ensuring consistent quality and reliable delivery.

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Enduring Excellence

Songxi adheres to integrity and quality throughout material selection, production, and delivery, turning reliability into a competitive advantage and earning long-term customer trust through professional service and continuous improvement across global markets.