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Engineered polymer solutions formulated for PCB dielectric protection, structural bonding, and high-frequency power electronics reliability.
Meeting the rigorous demands of high-frequency power electronics, compact architecture, and extreme environmental exposure.
Modern industrial inverters, Variable Frequency Drives (VFDs), and Insulated Gate Bipolar Transistor (IGBT) power modules operate under increasingly dense spatial layouts, high switching frequencies, and elevated operating voltages (600V up to 6.5kV). In these harsh operating environments, standard conformal coatings and non-specialized resins are inadequate to withstand recurring thermal shocks, moisture-laden atmospheric contaminants, and high electrostatic stresses.
Non-conductive epoxy resins designed specifically for printed circuit board (PCB) assemblies and IGBT power module sealing provide an indispensable barrier. These advanced two-component and single-component polymer systems deliver ultra-high volume resistivity (>1015 Ω·cm), exceptional dielectric breakdown strength (>25 kV/mm), and optimized Comparative Tracking Index (CTI > 600V, Class 0 rating). By eliminating electrical breakdown pathways and insulating micro-gaps between high-voltage busbars and sensitive gate driver circuitry, they protect system architectures against premature catastrophic failure.
Micro-bubble-free vacuum impregnation formulations reduce internal void formation to sub-micron thresholds, ensuring partial discharge inception voltages (PDIV) remain far higher than inverter peak switching transients.
Glass transition temperatures (Tg) engineered upwards of 150°C combined with tailored viscoelastic damping allow seamless thermal cycling between -50°C and +180°C without micro-cracking or interfacial delamination.
Formulated with halogen-free, eco-compliant flame retardant fillers that achieve UL 94 V-0 certified self-extinguishing capabilities without compromising flowability, cure kinetics, or electrical isolation.
Precision-engineered encapsulation and dielectric sealing across demanding power electronics topologies.
In heavy manufacturing plants, inverters drive multi-axis robotics, CNC machines, and centrifugal pumps. Non-conductive epoxy seals gate-driver boards against airborne metallic dust, cutting fluids, and continuous vibrational mechanical stress, preventing conductive bridge formation between high-voltage bus lines and micro-pitch microcontroller pins.
Silicon Carbide (SiC) and IGBT power modules experience rapid switching ($dv/dt$ exceeding 50 kV/µs). Standard silicone gels can suffer from bubble formation or oil bleeding under high electrical fields. High-purity non-conductive epoxy resins provide rigid structural containment, low ionic impurity concentrations (Cl⁻, Na⁺ < 5 ppm), and superior dielectric strength across bonding wires.
Outdoor utility-scale solar and wind installations endure drastic temperature swings, ultraviolet radiation, and severe moisture ingress. Non-conductive potting epoxy encapsulates DC-AC inversion bridges, planar transformers, and filtering choke coils, ensuring complete seal against condensation-induced electrolytic corrosion.
Electric vehicle (EV) traction inverters and electric locomotive propulsion converters require ultra-compact power density and maximum automotive-grade reliability. Non-conductive structural sealing epoxy bonds ceramic heat-sinks, encapsulates power lead pins, and preserves dielectric barriers under extreme mechanical shock and road vibrations.
Songxi Technology is a high-tech enterprise specializing in the R&D, production, and sales of electronic adhesives. Based on silicone, polyurethane, acrylic, and epoxy systems, we provide reliable bonding, sealing, and protection solutions for power electronics, optoelectronics, new energy, automotive, and aerospace industries.
We are committed to becoming a trusted provider of functional polymer material solutions for the electronics industry. Through continuous innovation and application development, we promote the localization of high-end electronic adhesives and help intelligent devices achieve greater stability and durability.
Comprehensive adhesive, sealing, and thermal management architectures engineered for modern industrial power systems.
Songxi's business covers three functional areas: adhesive & sealing, potting & protection, and thermal interface materials. Our product portfolio includes PCBA fixing adhesives, UV adhesives, sealants, thermal conductive potting compounds, thermal greases, pads, two-component thermal gels, EMI shielding sealants, and reactive hot melt adhesives.
Our products serve power batteries, photovoltaic modules, drones, automotive electronics, 5G communications, and LED lighting. We provide both standard products and customized solutions for applications such as BMS conformal coating, IGBT thermal filling, and power battery structural bonding, supported by extensive technical experience and application expertise.
Led by a Ph.D. in Polymer Materials from Sichuan University, Songxi's R&D team has nearly twenty years of silicone application experience and has participated in over 100 product development projects. We maintain cooperation with research institutions including Chenguang Chemical Research Institute, Sichuan University, and Beijing Institute of Technology.
Certified with ISO9001, Songxi operates a comprehensive management system covering procurement, production, inspection, and after-sales service. Our products comply with RoHS and REACH requirements, with SGS verification and UL 94 V-0 flame retardant certification, ensuring consistent quality and reliable delivery.
High-precision testing, automated compounding, and analytical characterization ensuring high product consistency for inverter and IGBT module encapsulation.
Songxi adheres to integrity and quality throughout material selection, production, and delivery, turning reliability into a competitive advantage and earning long-term customer trust through professional service and continuous improvement across global markets.
