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Tailored thermal interface silicone materials, two-component potting gels, and IPX8 sealants engineered specifically for automotive microcontrollers, ASIC battery monitoring chips, and power distribution units.
As electric vehicle (EV) architectures transition from 400V to 800V and beyond, the thermal power density within Battery Management Systems (BMS) has surged exponentially. Modern BMS microcontrollers (MCUs), Application-Specific Integrated Circuits (ASICs), cell-monitoring units (CMUs), and solid-state disconnect switches are exposed to intense localized Joule heating. Simultaneously, the rapid emergence of direct immersion liquid cooling using synthetic hydrocarbon oils, ester fluids, and dielectric refrigerants demands materials that deliver dual-functionality: high-efficiency heat transfer and uncompromising chemical resistance.
Conventional thermal interface materials (TIMs) and standard polydimethylsiloxane (PDMS) rubbers often undergo severe swelling, plasticizer leaching, or structural softening when subjected to direct oil mist, gear fluids, or dielectric immersion coolants at elevated temperatures (85°C to 125°C). Oil-resistant silicone formulations, incorporating fluoro-modified siloxane backbones and densely packed spherical ceramic fillers, have become the mission-critical foundation for guaranteeing lifetime electrical insulation and uninterrupted heat dissipation in automotive powertrain electronics.
Through molecular modification involving trifluoropropyl side-chains along the siloxane polymer backbone, our oil-resistant silicones form an impervious steric barrier against non-polar hydrocarbon oils and polar synthetic lubricants. This chemical architecture inhibits oil diffusion into the crosslinked elastomer matrix, preserving mechanical tensile strength and thermal conductivity over a 15-year vehicle service lifecycle.
Maximizing thermal conductivity without compromising rheological dispensability requires advanced particle engineering. We integrate multi-modal spherical aluminum oxide ($Al_2O_3$), aluminum nitride ($AlN$), and boron nitride ($BN$) micro-particles. This creates dense conductive percolation pathways that reach 1.5 to 4.5 W/m·K while maintaining low pump-out and low dispensing viscosity for automated assembly lines.
Electronic control units (ECUs) and BMS microchips endure severe coefficient of thermal expansion (CTE) mismatches between silicon dies, copper PCB traces, and aluminum enclosures. Our two-component silicone gels maintain an ultra-compliant Shore 00 hardness (10 to 60) across extreme temperature swings, eliminating mechanical stress on fine solder joints and bond wires.
A quantitative comparison of polymer chemistries under long-term synthetic transmission fluid and dielectric coolant immersion tests (1,000 hours @ 125°C):
| Performance Parameters | Oil-Resistant Silicone (Songxi R&D) | Standard PDMS Silicone | Rigid Epoxy Resins | Polyurethane (PU) Systems |
|---|---|---|---|---|
| Thermal Conductivity (W/m·K) | 1.5 - 4.5 W/m·K | 1.0 - 2.5 W/m·K | 0.8 - 2.0 W/m·K | 0.5 - 1.2 W/m·K |
| Volume Swelling Index (PAO Oil, 125°C) | > 18.5% (High Swell) | 12.0% - 25.0% (Degrading) | ||
| Operating Temperature Envelope | -50°C to +180°C | -40°C to +150°C | -40°C to +130°C | -40°C to +100°C |
| Stress Imparted to BMS IC Chips | Ultra-Low (Gel compliance) | Low to Moderate | High (Risk of solder fatigue) | Moderate |
| Flame Retardancy Standard | UL 94 V-0 Certified | UL 94 V-1 / HB | UL 94 V-0 | UL 94 V-2 / HB |
From localized microchip thermal conduction to comprehensive immersion module sealing, our specialized silicone materials safeguard vital automotive electronic sub-assemblies.
Modern lithium-ion battery packs utilize multi-tier BMS architectures comprising Master Controller Units (BMU) and distributed Cell Monitoring Units (CMU). The ASICs on these boards continuously calculate State of Charge (SOC), State of Health (SOH), and balance cell voltages. Dispensing high-thixotropic, oil-resistant thermal gel bridges the critical micro-gaps between the silicon packaging and the aluminum heat-sink casing, dissipating heat fluxes up to 35 W/cm² while isolating boards from fluid aerosols.
Immersion cooling submerges cells, busbars, and monitoring sensors in synthetic dielectric fluid for ultra-fast charging (350kW+). Traditional sealants lose adhesion and swell in contact with these dielectric liquids. Our specialized fluorinated silicone sealants ensure IPX8 hermetic sealing along enclosure seams, cable penetrations, and PCB feedthroughs, preventing fluid ingress and retaining structural elasticity.
Current sensing shunt resistors and Solid-State Relays (SSRs) within High-Voltage BDUs generate intense intermittent thermal loads during regenerative braking and rapid acceleration. Two-component potting silicones with high dielectric strength and UL 94 V-0 flame ratings encapsulate these components, suppressing electrical arcing while providing direct thermal conduction to the vehicle chassis.
In 3-in-1 and 8-in-1 electric drive units, the BMS controller often shares physical housing with the motor inverter and on-board charger (OBC). Transmission lubricants and thermal fluids create a hostile chemical environment. Our oil-resistant silicone adhesives maintain permanent elastomeric bonding between heatspreaders and control boards under harsh vibration profiles (ISO 16750-3).
Songxi Technology is a high-tech enterprise specializing in the R&D, production, and sales of electronic adhesives. Based on silicone, polyurethane, acrylic, and epoxy systems, we provide reliable bonding, sealing, and protection solutions for power electronics, optoelectronics, new energy, automotive, and aerospace industries.
We are committed to becoming a trusted provider of functional polymer material solutions for the electronics industry. Through continuous innovation and application development, we promote the localization of high-end electronic adhesives and help intelligent devices achieve greater stability and durability.
Providing comprehensive bonding, sealing, and thermal interface materials tailored for harsh electronic environments.
Songxi's business covers three functional areas: adhesive & sealing, potting & protection, and thermal interface materials. Our product portfolio includes PCBA fixing adhesives, UV adhesives, sealants, thermal conductive potting compounds, thermal greases, pads, two-component thermal gels, EMI shielding sealants, and reactive hot melt adhesives.
Our products serve power batteries, photovoltaic modules, drones, automotive electronics, 5G communications, and LED lighting. We provide both standard products and customized solutions for applications such as BMS conformal coating, IGBT thermal filling, and power battery structural bonding, supported by extensive technical experience and application expertise.
Led by a Ph.D. in Polymer Materials from Sichuan University, Songxi's R&D team has nearly twenty years of silicone application experience and has participated in over 100 product development projects. We maintain cooperation with research institutions including Chenguang Chemical Research Institute, Sichuan University, and Beijing Institute of Technology.
Certified with ISO9001, Songxi operates a comprehensive management system covering procurement, production, inspection, and after-sales service. Our products comply with RoHS and REACH requirements, with SGS verification and UL 94 V-0 flame retardant certification, ensuring consistent quality and reliable delivery.
Select from our laboratory-certified thermal gels, potting compounds, and environmental sealants optimized for automotive electrification.
Songxi adheres to integrity and quality throughout material selection, production, and delivery, turning reliability into a competitive advantage and earning long-term customer trust through professional service and continuous improvement across global markets.