Thermal Interface Materials – thermal grease for chip-level gaps & thermal pads for module-level uneven gaps

Songxi Technology's Interface Thermal Materials line covers two product series: a Thermal Grease Series (1.5–6.0 W/m·K) and a Thermal Conductive Pad Series (1.5–10.0 W/m·K). Both are silicone-based thermal interface materials designed to eliminate air gaps between heat-generating components and heatsinks, but they target different interface conditions----the grease for thin, chip-level contact points, and the pads for larger, uneven mechanical gaps across an assembly.

product details

Thermal Grease Series (1.5–6.0 W/m·K)

At chip level, bond line thickness is critical. Songxi's thermal compound grease uses sub-micron conductive fillers in a shear-stable silicone matrix, spreading into microscopic surface textures and compressing to ultra-thin bonds under assembly pressure. As a thermal transfer grease, it resists pump-out under thermal cycling, remaining stable even after years at 150°C.

Features

- Ultra-low thermal resistance with sub-micron fillers
- Anti-pump-out matrix for thermal cycle stability
- Excellent wetting for void-free contact
- Non-curing, stable at high temperatures
- Rheology tuned for automated dispensing

Specifications

Thermal Conductive Pad Series
Color	Gray White	Dark Gray	Blue	Pink	Reddish Brown	Gray	Gray	Gray	Gray
Thermal Conductivity (W/mK)	1.5	2.0	3.0	4.0	5.0	6.0	7.0	8.0	10.0
Thickness (mm)	0.2-12	0.2-12	0.3-12	0.3-5.0	0.5-5.0	0.5-5.0	0.5-5.0	0.5-5.0	0.5-5.0
Hardness (Shore 00)	30-90	30-90	30-90	30-90	60-90	60-90	50-80	50-80	50-80
Density (g/cc)	2.1	2.3	2.9	3.2	3.0	3.3	3.4	3.4	3.4

Applications

industrial IGBT modules, EV power electronics (OBC, power drives), smart home mainboards, and high-frequency microprocessor packaging.

Thermal Interface Materials – thermal grease for chip-level gaps & thermal pads for module-level uneven gaps (1)

Thermal Conductive Pad Series (1.5–10.0 W/m·K)

For full assemblies—BMS packs, inverters, multi-board enclosures—gaps are larger and less predictable. Songxi's thermal gap pads use a compliant low-hardness elastomer that deforms under low assembly force, filling uneven gaps without stressing components. As a thermal conductive silicone pad, it provides both thermal conduction and electrical isolation. Fiberglass reinforcement resists tearing, and low-volatile formulation limits oil bleeding.

Features

- Broad conductivity range (1.5–10.0 W/m·K)
- High compressibility for large gaps
- Low oil bleeding, protects nearby components
- High dielectric isolation
- Tear-resistant for automated assembly

Specifications

Thermal Conductive Grease Series
Color	White	White	White	White	White	White	White
Thermal Conductivity (W/mK)	1.5	2.0	3.0	3.5	4.0	5.0	6.0
Extrusion Rate (g/min)	75±15	75±15	30±5	30±5	30±5	25±5	15±5
Density (g/cc)	2.3	2.5	3.0	3.0	3.1	3.2	3.3