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Engineered for micro-optics stability, high dielectric isolation, and critical component bonding across advanced communication architectures.
Demanding hyper-scale data centers and AI computing fabrics require packaging adhesives that combine micron-level positioning precision with exceptional optical crosstalk suppression.
Formulated with pure titanium dioxide and high-refractive organic fillers, our white silicone achieves over 99.2% opacity in thin bond lines, completely eliminating multi-channel optical crosstalk inside dense QSFP-DD and OSFP modules.
Exceeding NASA SP-R-0022A and Telcordia GR-468-CORE standards, volatile condensable materials are strictly restrained. This prevents catastrophic photo-induced volatile condensation on laser facets, lenses, and photodiode active windows.
A controlled polydimethylsiloxane crosslinking network provides near-zero linear curing shrinkage (<0.1%) and a low modulus of elasticity, absorbing thermal expansion differentials between InP/GaAs dies, silicon chips, and ceramic/metal carriers.
With generative artificial intelligence (AI), machine learning clusters, and high-performance computing (HPC) driving optical networking from 100G/200G toward 800G, 1.6T, and future 3.2T architectures, packaging paradigms have transformed. Traditional epoxy adhesives, while delivering high mechanical stiffness, frequently suffer from thermal stress accumulation, micro-cracking during rapid temperature cycling (-40°C to +85°C), and significant optical shift over lifetime operations.
In modern multi-lane optical transceivers (such as 8x100G or 8x200G configurations), components are packed in tight proximity. Laser diodes (DFB, EML), silicon photonics Mach-Zehnder modulators, Fiber Array Units (FAU), and high-speed photodetectors operate under intense thermal flux. White Silicone Adhesive has emerged as the premier material solution for optical module coupling fixation and cavity sealing. Its distinct chemical profile delivers a resilient polymeric cushion that dampens mechanical shocks, manages thermal expansion mismatches, and prevents optical drift caused by environmental fluctuations.
Precision optical alignment demands mechanical tolerances within sub-micron thresholds. The role of the white silicone adhesive spans several interdisciplinary parameters:
| Property Parameter | Test Standard | Typical Value (Songxi White Optical Silicone) | Engineering Benefit |
|---|---|---|---|
| Appearance & Color | Visual Inspection | Bright White / Opaque Thixotropic Paste | Superior stray light reflection & optical isolation |
| Curing Mechanism | Room Temp / Mild Thermal Acceleration | Single-Component Alkoxy / Addition RTV | Non-corrosive to Au, Cu, Ag, and GaAs substrates |
| Linear Curing Shrinkage | ASTM D955 | < 0.10 % | Preserves micron-level active optical alignment lock |
| Outgassing (TML / CVCM) | ASTM E595 / NASA SP-R-0022A | TML < 0.45%, CVCM < 0.03% | Eliminates laser facet fogging & optical lens damage |
| Thermal Conductivity | ASTM D5470 | 0.8 – 1.5 W/m·K | Assists in localized heat conduction away from chips |
| Dielectric Strength | ASTM D149 | > 22 kV/mm | High insulation resistance against electrical breakdown |
| Operating Temperature Range | Telcordia GR-468 | -55 °C to +200 °C | Withstands extreme operating ambient & reflow profiles |
Transmitter Optical Sub-Assemblies (TOSA) and Receiver Optical Sub-Assemblies (ROSA) represent the core engines of optical communications. During active alignment, a robotic multi-axis stage aligns the laser diode beam through focusing lenses into the optical fiber core with sub-micron precision. Once maximum optical power is achieved, the white silicone adhesive is dispensed around the ferrule, lens holder, and housing sleeve. Its instant green strength and low-shrinkage curing lock the optical axis without inducing angular tilt or focal displacement.
In Silicon Photonics (SiPh) and Co-Packaged Optics (CPO) architectures, Fiber Array Units are attached to silicon photonic waveguides using optical clear adhesives for the light path, while peripheral mechanical reinforcement and light blocking are provided by white silicone adhesives. The silicone cushions mechanical stress caused by external fiber handling while creating an impervious barrier against ambient moisture.
The outer casing of transceivers (QSFP-DD, OSFP, CFP2) requires robust environmental and EMI protection. White silicone sealants provide long-term elasticity, resisting degradation from ozone, UV exposure, and thermal shock during non-stop data center operation over 10+ year operational life cycles.
Songxi Technology is a high-tech enterprise specializing in the R&D, production, and sales of electronic adhesives. Based on silicone, polyurethane, acrylic, and epoxy systems, we provide reliable bonding, sealing, and protection solutions for power electronics, optoelectronics, new energy, automotive, and aerospace industries.
We are committed to becoming a trusted provider of functional polymer material solutions for the electronics industry. Through continuous innovation and application development, we promote the localization of high-end electronic adhesives and help intelligent devices achieve greater stability and durability.
Delivering tailored material science breakthroughs across global electronic and optical supply chains.
Songxi's business covers three functional areas: adhesive & sealing, potting & protection, and thermal interface materials. Our product portfolio includes PCBA fixing adhesives, UV adhesives, sealants, thermal conductive potting compounds, thermal greases, pads, two-component thermal gels, EMI shielding sealants, and reactive hot melt adhesives.
Our products serve power batteries, photovoltaic modules, drones, automotive electronics, 5G communications, and LED lighting. We provide both standard products and customized solutions for applications such as BMS conformal coating, IGBT thermal filling, and power battery structural bonding, supported by extensive technical experience and application expertise.
Led by a Ph.D. in Polymer Materials from Sichuan University, Songxi's R&D team has nearly twenty years of silicone application experience and has participated in over 100 product development projects. We maintain cooperation with research institutions including Chenguang Chemical Research Institute, Sichuan University, and Beijing Institute of Technology.
Certified with ISO9001, Songxi operates a comprehensive management system covering procurement, production, inspection, and after-sales service. Our products comply with RoHS and REACH requirements, with SGS verification and UL 94 V-0 flame retardant certification, ensuring consistent quality and reliable delivery.
Explore our full line of functional polymer systems developed for telecommunications, automotive electronics, and smart hardware assembly.
Songxi adheres to integrity and quality throughout material selection, production, and delivery, turning reliability into a competitive advantage and earning long-term customer trust through professional service and continuous improvement across global markets.